DMT2004UPS
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Drain-Source Voltage
Symbol
VDSS
Value
24
Unit
V
Gate-Source Voltage
±12
V
VGSS
Steady
State
TC = +25°C
TC = +70°C
80
65
A
Continuous Drain Current (Note 7) VGS = 10V
ID
Pulsed Drain Current (10μs Pulse, Duty Cycle = 1%)
Continuous Source-Drain Diode Current (Note 6)
Avalanche Current (Note 8) L = 0.1mH
160
2
A
A
IDM
IS
IAS
26
36
A
Avalanche Energy (Note 8) L = 0.1mH
mJ
EAS
Thermal Characteristics
Characteristic
Total Power Dissipation
Symbol
PD
R
Value
1.4
88
Units
W
TA = +25°C
Steady State
TA = +25°C
Steady State
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation
°C/W
W
JA
PD
Thermal Resistance, Junction to Ambient (Note 6)
Thermal Resistance, Junction to Case (Note 7)
Operating and Storage Temperature Range
°C/W
°C/W
°C
R
JA
2.5
R
JC
-55 to +150
TJ, TSTG
Electrical Characteristics (TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 9)
Drain-Source Breakdown Voltage
Symbol
Min
Typ
Max
Unit
Test Condition
24
—
—
—
—
—
—
1
V
BVDSS
IDSS
VGS = 0V, ID = 250μA
µA
nA
Zero Gate Voltage Drain Current (TJ = +25°C)
Gate-Source Leakage
VDS = 20V, VGS = 0V
VGS = ±10V, VDS = 0V
±100
IGSS
ON CHARACTERISTICS (Note 9)
Gate Threshold Voltage
0.55
—
—
3.7
4.5
7.5
0.65
1.45
5.0
V
mΩ
V
VGS(TH)
RDS(ON)
VSD
VDS = VGS, ID = 250μA
VGS = 10V, ID = 20A
VGS = 4.5V, ID = 20A
VGS = 2.5V, ID = 20A
VGS = 0V, IS = 2A
—
Static Drain-Source On-Resistance
6.5
—
10.0
1.0
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 10)
Input Capacitance
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
1683
581
559
1.6
Ciss
Coss
Crss
RG
VDS = 15V, VGS = 0V,
f = 1.0MHz
Output Capacitance
pF
Reverse Transfer Capacitance
Gate Resistance
Ω
VDS = 0V, VGS = 0V, f = 1.0MHz
29.6
53.7
4.2
Total Gate Charge (VGS = 4.5V)
Total Gate Charge (VGS = 10V)
Gate-Source Charge
Qg
Qg
nC
ns
VDD = 15V, ID = 9A
Qgs
Qgd
tD(ON)
tR
13.4
3.9
Gate-Drain Charge
Turn-On Delay Time
9.6
Turn-On Rise Time
VDD = 15V, VGS = 10V,
RG = 3Ω, ID = 9A
30.8
38.6
11.2
22.9
Turn-Off Delay Time
tD(OFF)
tF
Turn-Off Fall Time
Reverse Recovery Time
Reverse Recovery Charge
ns
tRR
IF = 1.5A, di/dt = 100A/μs
nC
QRR
Notes:
5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate.
7. Thermal resistance from junction to soldering point (on the exposed drain pad).
8. IAS and EAS rating are based on low frequency and duty cycles to keep TJ = +25°C .
9. Short duration pulse test used to minimize self-heating effect.
10. Guaranteed by design. Not subject to product testing.
PowerDI is a registered trademark of Diodes Incorporated.
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July 2016
© Diodes Incorporated
DMT2004UPS
Document number: DS38955 Rev. 1 - 2