ABSOLUTE MAXIMUM RATINGS(1)
PIN CONNECTIONS
VDD (Pin 16) to Ground ...................................................................... +17V
Top View
DIP/SOIC
VREF (Pin 17) to Ground ..................................................................... +25V
VRPB (Pin 18) to Ground ..................................................................... ±25V
Digital Input Voltage (pins 4-15) to Ground ...............................–0.4V, VDD
VPIN 1, VPIN 2 to Ground ............................................................. –0.4V, VDD
Power Dissipation (any Package):
To +75°C ..................................................................................... 450mW
Derates above +75°C .............................................................. –6mW/°C
Lead Temperature (soldering, 10s)................................................ +300°C
Storage Temperature: Plastic Package ......................................... +125°C
1
2
3
4
5
6
7
8
9
18 RFB
IOUT 1
IOUT 2
17 VREF
16 +VDD
15 Bit 12 (LSB)
14 Bit 11
13 Bit 10
12 Bit 9
GND
Bit 1 (MSB)
Bit 2
DAC7541A
NOTE: (1) Stresses above those listed above may cause permanent damage to
the device. This is a stress rating only and functional operation of the device at
these or any other condition above those indicated in the operational sections of
thisspecificationisnotimplied.Exposuretoabsolutemaximumratingconditions
for extended periods may affect device reliability.
Bit 3
Bit 4
Bit 5
11 Bit 8
Bit 6
10 Bit 7
ELECTROSTATIC
DISCHARGE SENSITIVITY
PACKAGE INFORMATION
PACKAGE DRAWING
NUMBER(1)
The DAC7541A is an ESD (electrostatic discharge) sensi-
tive device. The digital control inputs have a special FET
structure, which turns on when the input exceeds the supply
by 18V, to minimize ESD damage. However, permanent
damage may occur on unconnected devices subject to high
energy electrostatic fields. When not in use, devices must be
stored in conductive foam or shunts. The protective foam
should be discharged to the destination socket before
devices are removed.
MODEL
PACKAGE
DAC7541JP
DAC7541KP
Plastic DIP
Plastic DIP
218
218
DAC7541JU
DAC7541KU
Plastic SOIC
Plastic SOIC
219
219
DAC7541JP-BI
DAC7541KP-BI
Plastic DIP
Plastic DIP
218
218
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix D of Burr-Brown IC Data Book.
BURN-IN SCREENING
Burn-in screening is an option available for the models in the
Ordering Information table. Burn-in duration is 160 hours at
the indicated temperature (or equivalent combination of time
and temperature).
All units are tested after burn-in to ensure that grade speci-
fications are met. To order burn-in, add “-BI” to the base
model number.
ORDERING INFORMATION
TEMPERATURE
RELATIVE
MODEL
PACKAGE
RANGE
ACCURACY (LSB)
GAIN ERROR (LSB)
DAC7541AJP
DAC7541AKP
DAC7541AJU
DAC7541AKU
Plastic DIP
Plastic DIP
Plastic SOIC
Plastic SOIC
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
±1
±1/2
±1
±6
±1
±6
±1
±1/2
BURN-IN SCREENING OPTION
See text for details.
TEMPERATURE
RANGE
RELATIVE
ACCURACY (LSB)
BURN-IN TEMP.
(160 Hours)(1)
MODEL
PACKAGE
DAC7541AJP-BI
DAC7541AKP-BI
Plastic DIP
Plastic DIP
0°C to +70°C
0°C to +70°C
±1
±1/2
+85°C
+85°C
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN
assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject
to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not
authorize or warrant any BURR-BROWN product for use in life support devices and/or systems.
®
3
DAC7541A
5秒后页面跳转
MAX6675资料手册参数详解、引脚配置说明
LM258引脚图及功能介绍、主要参数分析
CD4052资料手册参数详解、引脚配置说明
一文带你了解TPS5430资料手册分析：参数介绍、引脚配置说明
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
数据手册
如果您发现信息不准确，
