DAC104S085
www.ti.com
SNAS362E –MAY 2006–REVISED OCTOBER 2012
PIN DESCRIPTIONS
SON
VSSOP
Pin No.
Symbol
Type
Description
1
2
3
4
5
6
VA
Supply
Power supply input. Must be decoupled to GND.
VOUTA
VOUTB
VOUTC
VOUTD
GND
Analog Output
Analog Output
Analog Output
Analog Output
Ground
Channel A Analog Output Voltage.
Channel B Analog Output Voltage.
Channel C Analog Output Voltage.
Channel D Analog Output Voltage.
Ground reference for all on-chip circuitry.
Unbuffered reference voltage shared by all channels. Must be decoupled
to GND.
7
8
VREFIN
DIN
Analog Input
Digital Input
Serial Data Input. Data is clocked into the 16-bit shift register on the
falling edges of SCLK after the fall of SYNC.
Frame synchronization input for the data input. When this pin goes low, it
enables the input shift register and data is transferred on the falling edges
of SCLK. The DAC is updated on the 16th clock cycle unless SYNC is
brought high before the 16th clock, in which case the rising edge of
SYNC acts as an interrupt and the write sequence is ignored by the DAC.
9
SYNC
SCLK
Digital Input
Serial Clock Input. Data is clocked into the input shift register on the
falling edges of this pin.
10
11
Digital Input
Ground
Exposed die attach pad can be connected to ground or left floating.
Soldering the pad to the PCB offers optimal thermal performance and
enhances package self-alignment during reflow.
PAD
(SON only)
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
(1)(2)(3)
Absolute Maximum Ratings
Supply Voltage, VA
6.5V
−0.3V to 6.5V
10 mA
Voltage on any Input Pin
Input Current at Any Pin(4)
Package Input Current(4)
Power Consumption at TA = 25°C
ESD Susceptibility(6)
20 mA
(5)
See
Human Body Model
Machine Model
2500V
250V
Junction Temperature
Storage Temperature
+150°C
−65°C to +150°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see
the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics
may degrade when the device is not operated under the listed test conditions. Operation of the device beyond the maximum Operating
Ratings is not recommended.
(2) All voltages are measured with respect to GND = 0V, unless otherwise specified.
(3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(4) When the input voltage at any pin exceeds 5.5V or is less than GND, the current at that pin should be limited to 10 mA. The 20 mA
maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 10
mA to two.
(5) The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by
TJmax, the junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA), and can be calculated using the formula
PDMAX = (TJmax − TA) / θJA. The values for maximum power dissipation will be reached only when the device is operated in a severe
fault condition (e.g., when input or output pins are driven beyond the operating ratings, or the power supply polarity is reversed).
(6) Human body model is 100 pF capacitor discharged through a 1.5 kΩ resistor. Machine model is 220 pF discharged through ZERO
Ohms.
Copyright © 2006–2012, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Links: DAC104S085