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DAC081C081 PDF预览

DAC081C081

更新时间: 2024-01-06 21:58:59
品牌 Logo 应用领域
德州仪器 - TI 转换器数模转换器
页数 文件大小 规格书
42页 1453K
描述
具有 I2C 兼容接口的 8 位微功耗数模转换器

DAC081C081 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:SON
包装说明:HVSON, SOLCC6,.1,25针数:6
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.18
最大模拟输出电压:5.5 V最小模拟输出电压:
转换器类型:D/A CONVERTER输入位码:BINARY
输入格式:SERIALJESD-30 代码:R-PDSO-N6
JESD-609代码:e3长度:2.5 mm
最大线性误差 (EL):0.2344%湿度敏感等级:1
位数:8功能数量:1
端子数量:6最高工作温度:125 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:HVSON封装等效代码:SOLCC6,.1,25
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度):260电源:3/5 V
认证状态:Not Qualified采样速率:0.18 MHz
座面最大高度:0.8 mm最大稳定时间:4.5 µs
标称安定时间 (tstl):3 µs子类别:Other Converters
最大压摆率:0.5 mA标称供电电压:3 V
表面贴装:YES技术:CMOS
温度等级:AUTOMOTIVE端子面层:Matte Tin (Sn)
端子形式:NO LEAD端子节距:0.65 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:2.2 mmBase Number Matches:1

DAC081C081 数据手册

 浏览型号DAC081C081的Datasheet PDF文件第3页浏览型号DAC081C081的Datasheet PDF文件第4页浏览型号DAC081C081的Datasheet PDF文件第5页浏览型号DAC081C081的Datasheet PDF文件第7页浏览型号DAC081C081的Datasheet PDF文件第8页浏览型号DAC081C081的Datasheet PDF文件第9页 
DAC081C081, DAC081C085  
SNAS449F FEBRUARY 2008REVISED MAY 2017  
www.ti.com  
7.3 Recommended Operating Conditions  
(1)  
See  
MIN  
40  
2.7  
1
NOM  
MAX  
125  
5.5  
UNIT  
°C  
V
Operating Temperature  
Supply Voltage, VA  
Reference Voltage, VREFIN  
Digital Input Voltage(2)  
Output Load  
TA  
VA  
V
5.5  
V
0
1500  
pF  
(1) All voltages are measured with respect to GND = 0 V, unless otherwise specified.  
(2) The inputs are protected as shown below. Input voltage magnitudes up to 5.5 V, regardless of VA, will not cause errors in the conversion  
result. For example, if VA is 3 V, the digital input pins can be driven with a 5V logic device.  
L/h  
Çh LbÇ9wb![  
ꢀLwꢀÜLÇwò  
Db5  
7.4 Thermal Information  
DAC081C081  
DAC081C085  
DGK (VSSOP)  
8 PINS  
THERMAL METRIC(1)(2)  
NGF (WSON)  
DDC (SOT)  
6 PINS  
250  
UNIT  
6 PINS  
RθJA  
Junction-to-ambient thermal resistance  
190  
240  
°C/W  
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application  
report, SPRA953.  
(2) Soldering process must comply with Reflow Temperature Profile specifications. Refer to http://www.ti.com/packaging.  
Reflow temperature profiles are different for lead-free packages.  
6
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Copyright © 2008–2017, Texas Instruments Incorporated  
Product Folder Links: DAC081C081 DAC081C085  

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