DAC0800, DAC0802
SNAS538C –JUNE 1999–REVISED FEBRUARY 2013
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(1)
Absolute Maximum Ratings
Supply Voltage (V+ − V−)
±18V or 36V
500 mW
(2)
Power Dissipation
Reference Input Differential Voltage
(V14 to V15)
V− to V+
Reference Input Common-Mode
Range (V14, V15)
V− to V+
5 mA
V− to V− plus 36V
Reference Input Current
Logic Inputs
Analog Current Outputs
(VS− = −15V)
4.25 mA
TBD V
(3)
ESD Susceptibility
Storage Temperature
−65°C to +150°C
Lead Temp. (Soldering, 10 seconds)
PDIP Package (plastic)
CDIP Package (ceramic)
Surface Mount Package
Vapor Phase (60 seconds)
Infrared (15 seconds)
260°C
300°C
215°C
220°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not
apply when operating the device beyond its specified operating conditions.
(2) The maximum junction temperature of the DAC0800 and DAC0802 is 125°C. For operating at elevated temperatures, devices in the
CDIP package must be derated based on a thermal resistance of 100°C/W, junction-to-ambient, 175°C/W for the molded PDIP package
and 100°C/W for the SOIC package.
(3) Human body model, 100 pF discharged through a 1.5 kΩ resistor.
Operating Conditions(1)
Min
Max
Units
Temperature (TA)
DAC0800L
DAC0800LC
DAC0802LC
V+
−55
+125
°C
°C
°C
V
0
+70
0
+70
(V−) + 30
(V−) + 10
V−
−15
1
−5
2
V
IREF (V− = −5V)
IREF (V− = −15V)
mA
mA
1
4
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not
apply when operating the device beyond its specified operating conditions.
2
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