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CYII4SM6600AB-QDC PDF预览

CYII4SM6600AB-QDC

更新时间: 2024-01-26 05:45:14
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 传感器换能器图像传感器时钟
页数 文件大小 规格书
40页 1753K
描述
6.6 MP CMOS Image Sensor

CYII4SM6600AB-QDC 技术参数

生命周期:ObsoleteReach Compliance Code:unknown
风险等级:5.17Is Samacsys:N
其他特性:ELECTRONIC ROLLING SHUTTER阵列类型:FULL FRAME
主体宽度:24.13 mm主体高度:3.04 mm
主体长度或直径:24.13 mm数据速率:40 Mbps
动态范围:59 dB帧速率:5 fps
水平像素:2210外壳:CERAMIC
主时钟:40 MHz安装特点:SURFACE MOUNT
最大工作电流:80 mA最高工作温度:65 °C
最低工作温度:-30 °C光学格式:1 inch
输出接口类型:3-WIRE INTERFACE输出范围:0.50-2.80V
输出类型:DIGITAL VOLTAGE封装形状/形式:SQUARE
像素大小:3.5X3.5 µm灵敏度(V / lx.s):4.83 V/lx.s
传感器/换能器类型:IMAGE SENSOR,CMOS最大供电电压:3.3 V
最小供电电压:2.5 V表面贴装:YES
端接类型:SOLDER垂直像素:3002
Base Number Matches:1

CYII4SM6600AB-QDC 数据手册

 浏览型号CYII4SM6600AB-QDC的Datasheet PDF文件第1页浏览型号CYII4SM6600AB-QDC的Datasheet PDF文件第2页浏览型号CYII4SM6600AB-QDC的Datasheet PDF文件第4页浏览型号CYII4SM6600AB-QDC的Datasheet PDF文件第5页浏览型号CYII4SM6600AB-QDC的Datasheet PDF文件第6页浏览型号CYII4SM6600AB-QDC的Datasheet PDF文件第7页 
IBIS4-A-6600  
CYII4SM6600AB  
ADVANCE  
INFORMATION  
LIST OF FIGURES  
Spectral Response Curve ...................................................................................................6  
Electro-voltaic Response Curve ..........................................................................................7  
Floor Plan ............................................................................................................................9  
3T Pixel Architecture ...........................................................................................................10  
RGB Bayer Alignment .........................................................................................................10  
Typical Response Curve of the RGB Filters .......................................................................10  
Floor Plan Pixel Array .........................................................................................................11  
Output Amplifier Architecture ..............................................................................................12  
Offset for the Two Channels through DAC_RAW and DAC_FINE .....................................13  
ADC resistor ladder .............................................................................................................14  
X-subsampling ....................................................................................................................15  
Y-subsampling ....................................................................................................................16  
Pixel Readout in Various Subsample Modes ......................................................................17  
Electronic Rolling Shutter Operation ...................................................................................18  
Double Slope Response .....................................................................................................19  
Principle of Non-destructive Readout .................................................................................19  
Syncing of the Y-shift Registers. .........................................................................................23  
SPI Interface .......................................................................................................................25  
Relative Timing of the 3 Control Signals .............................................................................26  
Basic Frame and Line Timing .............................................................................................27  
Pixel Output Timing using Two Analog Outputs .................................................................27  
Pixel Output Timing Multiplexing to One Analog Output .....................................................28  
ADC Timing using Two Analog Outputs .............................................................................28  
ADC Timing using One Analog Output ...............................................................................28  
Bare Die Dimensions ..........................................................................................................32  
Package Top View (all dimensions in inch) ........................................................................33  
Package Side View (all dimensions in inch) .......................................................................34  
Package Back View (all dimensions in inch) .......................................................................35  
Bonding Scheme of the IBIS4-A-6600 in the LCC Package ...............................................36  
Transmittance Curve of the D263 Cover Glass Lid ............................................................37  
Reflow Soldering Temperature Profile ................................................................................38  
Document Number: 001-02366 Rev. *D  
Page 3 of 40  
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