CY62127DV30
1-Mb (64K x 16) Static RAM
portable applications such as cellular telephones. The device
also has an automatic power-down feature that significantly
reduces power consumption by 90% when addresses are not
toggling. The device can be put into standby mode reducing
power consumption by more than 99% when deselected (CE
HIGH or both BHE and BLE are HIGH). The input/output pins
(I/O0 through I/O15) are placed in a high-impedance state
when: deselected (CE HIGH), outputs are disabled (OE
HIGH), both Byte High Enable and Byte Low Enable are
disabled (BHE, BLE HIGH) or during a write operation (CE
LOW and WE LOW).
Features
• Temperature Ranges
— Industrial: –40°C to 85°C
— Automotive: –40°C to 125°C
• Very high speed: 45 ns
• Wide voltage range: 2.2V to 3.6V
• Pin compatible with CY62127BV
• Ultra-low active power
Writing to the device is accomplished by taking Chip Enable
(CE) and Write Enable (WE) inputs LOW. If Byte Low Enable
(BLE) is LOW, then data from I/O pins (I/O0 through I/O7), is
written into the location specified on the address pins (A0
through A15). If Byte High Enable (BHE) is LOW, then data
from I/O pins (I/O8 through I/O15) is written into the location
specified on the address pins (A0 through A15).
— Typical active current: 0.85 mA @ f = 1 MHz
— Typical active current: 5 mA @ f = fMAX
• Ultra-low standby power
• Easy memory expansion with CE and OE features
• Automatic power-down when deselected
• Available in Pb-Free and non Pb-Free 48-ball FBGA and
a 44-lead TSOP Type II packages
Reading from the device is accomplished by taking Chip
Enable (CE) and Output Enable (OE) LOW while forcing the
Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW,
then data from the memory location specified by the address
pins will appear on I/O0 to I/O7. If Byte High Enable (BHE) is
LOW, then data from memory will appear on I/O8 to I/O15. See
the truth table at the back of this data sheet for a complete
Functional Description[1]
The CY62127DV30 is a high-performance CMOS static RAM
organized as 64K words by 16 bits. This device features
advanced circuit design to provide ultra-low active current.
This is ideal for providing More Battery Life™ (MoBL®) in
description of read and write modes
.
Logic Block Diagram
DATA IN DRIVERS
10
A10
A9
A8
A7
A6
A5
A4
A3
A2
64K x 16
RAM Array
2048 x 512
I/O0–I/O7
I/O8–I/O15
A1
A0
COLUMN DECODER
BHE
WE
CE
OE
BLE
CE
Power -Down
Circuit
BHE
BLE
Note:
1. For best-practice recommendations, please refer to the Cypress application note “System Design Guidelines” on http://www.cypress.com.
Cypress Semiconductor Corporation
Document #: 38-05229 Rev. *H
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised June 19, 2006
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