WAFER LEVEL PACKAGING
data sheet
nl™
CSP
Features:
• 4-64 ball count
• 0.8 mm - 4.5 mm body size
• Repassivation, Redistribution and Bumping options available
• Electroplated and Ball-loaded bumping options
• Eutectic, High Lead and Lead-free solder
• Standard JEDEC/EIAJ pitches and CSP solder ball diameters
• Compatible with conventional SMT assembly and test techniques
• Back-side laser mark compatible
nl™
Wafer Level Packaging CSP
Amkor's wafer level packaging service meets the industry's
growing demand for full turnkey assembly and test solu-
tions for CSP (Chip Scale Package) products. Through the
acquisition of Unitive, Amkor has adopted the CSPnl™ as
its standard wafer level package offering. CSPnl™ repre-
sents the next level in wafer level chip scale packaging as
demonstrated by its proven benchmark reliability. Amkor's
CSPnl™ has been widely adopted as the industry standard
for cost effective, reliable, high performance wafer level
CSP applications. By integrating our CSPnl™ packaging
technology with existing die processing and testing servic-
es as well as new die processing technologies developed by
Unitive, Amkor is able to offer a full turnkey solution for
wafer level products.
• Back-side laminate
• Impressive component and board level reliability
• Cost effective packaging solution for small ICs
• No need for underfill
• Full turnkey bumping, test and TnR support
• Ship to customer in either wafer form or singulated form
Ball Loading:
Package
Options:
Pitch
Sphere Diameter
0.25 mm
0.30 mm, 0.35 mm
0.35 mm
0.50 mm
0.40 mm
0.50 mm
0.65 mm
0.75 mm
Reliability:
Package Level:
CSPnl™ is a true wafer level CSP package that can incor-
porate thin film redistribution films to route I/O pads to
JEDEC/EIAJ standard pitches, and thereby, avoiding the
need to redesign legacy parts for CSP applications. It is
available in three options: Direct Bump on Pad (BOP),
Bump on Repassivation/Redistribution and Bump on Thick
Repassivation/Redistribution. The technology used for
CSPnl™ results in robust packages that do not require
underfill in their applications. CSPnl™ is designed to uti-
lize industry-standard surface mount assembly and reflow
techniques. By using conventional SMT placement equip-
ment and avoiding the need for underfill, the end-user
experiences many of the cost benefits associated with other
JEDEC standard area array packages.
• Autoclave (PCT) 121°C/100% RH/15 psig, 96 hours
• Temp Cycle -55°C/+125°C, 500 cycles
• High Temp storage 170°C, 420 hours
Second Level Reliability (BLR):
• HAST
• HTOL
130°C/85%RH/33.5psia/Biased, 96 hours
150°C/Biased, 300 hours
• Temp Cycle -40°C/+125°C, 1000 cycles
• Key Push
• Bend Test
• Drop Test
100cycles/min, 2.7mm max displacement
Strain rate 5mm/min, 85mm span
50cm height
Applications:
Amkor's wafer bumping and test offering is an excellent
complement to other Amkor product lines. Through an
integrated die processing service, Amkor is able to provide
full turnkey wafer bumping, test, die singulation, and tape
& reel support for wafer level packaging applications. In
addition, Amkor is able to integrate its wafer bumping
products into high performance packaging options, such as
Flip Chip CSP (fcCSP) and System in Package (SiP). Amkor
truly provides one-stop, hassle-free support for wafer
bumping, packaging, and test solutions, enabling you to
meet your cost and time-to-market objectives.
Amkor's CSPnl™ is ideal for portable communications and related appli-
cations that require a low cost packaging solution with small form fac-
tor and improved signal propagation characteristics. EEPROM, flash,
DRAM, integrated passive networks, and standard analog devices are all
technologies that benefit from the CSPnl™ package attributes. End
products include mobile phones, PDAs, laptop PCs, disk drives, digital
cameras, MP3 players, GPS navigation devices, and other portable prod-
ucts.
VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND
TO VIEW THE MOST CURRENT PRODUCT INFORMATION
.
DS720A
Rev Date: 12’05
www.amkor.com
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