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CS230N06B0 PDF预览

CS230N06B0

更新时间: 2024-03-03 10:09:32
品牌 Logo 应用领域
华润微 - CRMICRO /
页数 文件大小 规格书
9页 429K
描述
TO-263(或D2PAK)

CS230N06B0 数据手册

 浏览型号CS230N06B0的Datasheet PDF文件第2页浏览型号CS230N06B0的Datasheet PDF文件第3页浏览型号CS230N06B0的Datasheet PDF文件第4页浏览型号CS230N06B0的Datasheet PDF文件第5页浏览型号CS230N06B0的Datasheet PDF文件第6页浏览型号CS230N06B0的Datasheet PDF文件第7页 
Silicon N-Channel Power MOSFET  
CS230N06 B0  
R
General Description  
VDSS  
ID(  
60  
230  
284  
3
V
CS230N06 B0, the silicon N-channel Enhanced  
VDMOSFETs, is obtained by the high density Trench  
technology which reduce the conduction loss, improve switching  
performance and enhance the avalanche energy. This device is  
suitable for use as a load switch and PWM applications. The  
package form is TO-263, which accords with the RoHS standard.  
A
W
Silicon limited current)  
PD(TC=25)  
RDS(ON)Typ  
m  
Features  
l Fast Switching  
l Low ON Resistance(Rdson3.6 m)  
l Low Gate Charge  
l Low Reverse transfer capacitances  
l 100% Single Pulse avalanche energy Test  
Applications:  
Power switch circuit of adaptor and charger.  
AbsoluteTC= 25unless otherwise specified)  
Parameter  
Symbol  
VDSS  
Rating  
Units  
Drain-to-Source Voltage  
60  
V
A
Continuous Drain Current(Silicon Limited)  
Continuous Drain Current TC = 100 °C  
Pulsed Drain Current  
230  
ID  
145  
A
a1  
920  
A
IDM  
Gate-to-Source Voltage  
VGS  
V
±20  
a2  
Avalanche Energy  
1024  
mJ  
A
EAS  
a2  
Avalanche Current  
64  
284  
IAS  
Power Dissipation  
W
PD  
Derating Factor above 25°C  
Operating Junction and Storage Temperature Range  
2.272  
W/℃  
TJTstg  
15055 to 150  
WUXI CHINA RESOURCES HUAJING MICROELECTRONICS CO., LTD. Page 1 of 9  
2019V01  

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