CMS
SLIDE SWITCHES (SMD)
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STANDARD SPECIFICATIONS
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ELECTRICAL CHARACTERISTICS
Operating temp. range
Storage temp. range
Sealing
Contact rating
Non-switching
Switching
− 40 ~ 85 °C
DC50 V 100 mA
DC12 V 100 mA
DC20 mV 1 μA
Minimum
Non washable
Contact timing
Non-shorting
0.40 g (CMS-2202)
0.42 g (CMS-2214)
0.48 g (CMS-2314)
0.54 g (CMS-2414)
0.80 g (CMS-4202)
0.84 g (CMS-4216)
0.45 g (CMS-2302)
0.50 g (CMS-2402)
0.42 g (CMS-2212)
0.48 g (CMS-2312)
0.54 g (CMS-2412)
Contact resistance
Insulation resistance
Dielectric strength
70 mΩmaximum
100 MΩminimum (DC500 V)
AC500 V, 60 s
Net weight
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MECHANICAL CHARACTERISTICS
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ENVIRONMENTAL CHARACTERISTICS
Amplitude 1.5 mm or
No. of positions
2, 3, 4
Vibration
Acceleration 98 m/s2,
10-500-10 Hz, 3 directions for 10 cycles each
Stroke
2 mm
490 m/s2, 11 ms, sinusoidal wave half cycle,
Operating force
Stop strength
Solderability
1.5 1 N {0.15 0.1 kgf}
30 N {3.06 kgf} 15 s
Shock
6 directions for 3 times each
Continuous load 30000 cycles,
DC12 0.5 V, 100 10 mA
Load life
(
Top setting
)
40 °C, Relative humidity 90 ~ 95 %,
245 3 °C 2 ~ 3 s
Humidity
240 h, No load
High temp. exposure
Low temp. exposure
Thermal shock
85 °C, 96 h, No load
−40 °C, 96 h, No load
Flow:260ꢀꢁ °C65~ 6 s
Reflow:255 °C (Peak temperature)
(Please refer to the profile below)
Soldering heat
−40 (0.5 h) ~ 85 °C (0.5 h), 5 cycles
Manual soldering:350 10 °C, 3 ~ 4 s
50 N {5.09 kgf} 10 s
Shear (Adhesion)
Substrate bending
Pull-off strength
Width 90 mm, bend 3 mm, 5 s, 1 time
50 N {5.09 kgf} 10 s
{ } : Reference only
〈
Reflow profile for soldering heat evaluation
〉
(C)
250
Peak : 250 +5
C
0
Over 230 C
200
Pre Heating Zone
180 C
150
150 C
90 30 s
30 10 s
100
50
Soldering Zone
Heating time
Reflow : two times maximum