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CDR33BP332AFYP PDF预览

CDR33BP332AFYP

更新时间: 2023-07-15 00:00:00
品牌 Logo 应用领域
基美 - KEMET /
页数 文件大小 规格书
10页 1143K
描述
Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.0033uF, Surface Mount, 1210, CHIP

CDR33BP332AFYP 数据手册

 浏览型号CDR33BP332AFYP的Datasheet PDF文件第4页浏览型号CDR33BP332AFYP的Datasheet PDF文件第5页浏览型号CDR33BP332AFYP的Datasheet PDF文件第6页浏览型号CDR33BP332AFYP的Datasheet PDF文件第8页浏览型号CDR33BP332AFYP的Datasheet PDF文件第9页浏览型号CDR33BP332AFYP的Datasheet PDF文件第10页 
TANTALUM, CERAMIC AND  
ALUMINUM CHIP CAPACITORS  
Packaging Information  
Performance Notes  
1. Cover Tape Break Force: 1.0 Kg Minimum.  
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:  
Tape Width  
8 mm  
Peel Strength  
0.1 Newton to 1.0 Newton ꢀ10g to 100gꢁ  
12 mm  
0.1 Newton to 1.3 Newton ꢀ10g to 130gꢁ  
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier  
tape shall be 165to 180from the plane of the carrier tape. During peeling, the carrier and/or cover tape  
shall be pulled at a velocity of 300 10 mm/minute.  
3. Reel Sizes: Molded tantalum capacitors are available on either 180 mm ꢀ7"ꢁ reels ꢀstandardꢁ or 330 mm ꢀ13"ꢁ  
reels ꢀwith C-7280ꢁ. Note that 13reels are preferred.  
4. Labeling: Bar code labeling ꢀstandard or customꢁ shall be on the side of the reel opposite the sprocket holes.  
Refer to EIA-556.  
Embossed Carrier Tape Configuration: Figure 1  
Table 1 — EMBOSSED TAPE DIMENSIONS ꢀMetric will governꢁ  
Constant Dimensions — Millimeters (Inches)  
Tape Size  
D0  
E
P0  
P2  
T Max  
T1 Max  
8 mm  
and  
12 mm  
1.5  
+0.10 -0.0  
ꢀ0.05ꢂ  
1.75 0.10  
4.0 0.10  
2.0 0.05  
0.600  
0.100  
ꢀ0.06ꢂ 0.004ꢁ ꢀ0.157 0.004ꢁ ꢀ0.07ꢂ 0.002ꢁ ꢀ0.024ꢁ  
ꢀ0.004ꢁ  
+0.004, -0.0ꢁ  
Variable Dimensions — Millimeters (Inches)  
Tape Size  
Pitch  
B1 Max.  
Note 1  
D1 Min.  
Note 2  
F
P1  
R Min. T2 Max  
Note 3  
W
A0B0K0  
Note 4  
8 mm  
Single  
4.4  
1.0  
3.5 0.05  
4.0 0.10  
25.0  
2.5  
8.0 0.30  
ꢀ4 mmꢁ  
ꢀ0.173ꢁ  
ꢀ0.03ꢂꢁ ꢀ0.138 0.002ꢁ ꢀ0.157 0.004ꢁ ꢀ0.ꢂ84ꢁ ꢀ0.0ꢂ8ꢁ ꢀ.315 0.012ꢁ  
12 mm  
Double  
ꢀ8 mmꢁ  
8.2  
ꢀ0.323ꢁ  
1.5 5.5 0.05 8.0 0.10 30.0 4.6 12.0 0.30  
ꢀ0.05ꢂꢁ ꢀ0.217 0.002ꢁ ꢀ0.315 0.004ꢁ ꢀ1.181ꢁ ꢀ0.181ꢁ ꢀ0.472 0.012ꢁ  
NOTES  
1. B1 dimension is a reference dimension for tape feeder clearance only.  
2. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of  
embossment location and hole location shall be applied independent of each other.  
3. Tape with components shall pass around radius Rwithout damage ꢀsee sketch Aꢁ. The minimum trailer length ꢀFig. 2ꢁ may require  
additional length to provide R min. for 12 mm embossed tape for reels with hub diameters approaching N min. ꢀTable 2ꢁ  
4. The cavity defined by A0, B0, and K0 shall be configured to surround the part with sufficient clearance such that the chip does not pro-  
trude beyond the sealing plane of the cover tape, the chip can be removed from the cavity in a vertical direction without mechanical  
restriction, rotation of the chip is limited to 20 degrees maximum in all 3 planes, and lateral movement of the chip is restricted to 0.5 mm  
maximum in the pocket ꢀnot applicable to vertical clearance.ꢁ  
94  
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300  

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