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CC2595RGTR PDF预览

CC2595RGTR

更新时间： 2024-01-23 07:50:50
品牌 Logo 应用领域
德州仪器 - TI 电信集成电路电信电路射频PC
页数 文件大小 规格书
13页 612K
描述
2.4-GHz RF FRONT END

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CC2595RGTR 技术参数

是否无铅：不含铅是否Rohs认证：符合
生命周期：Active零件包装代码：QFN
包装说明：QFN-16针数：16
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01Factory Lead Time：6 weeks
风险等级：0.9Samacsys Confidence：3
Samacsys Status：Released2D Presentation：https://componentsearchengine.com/2D/0T/886691.1.1.png
Schematic Symbol：https://componentsearchengine.com/symbol.php?partID=886691PCB Footprint：https://componentsearchengine.com/footprint.php?partID=886691
3D View：https://componentsearchengine.com/viewer/3D.php?partID=886691Samacsys PartID：886691
Samacsys Image：https://componentsearchengine.com/Images/9/CC2595RGTR.jpgSamacsys Thumbnail Image：https://componentsearchengine.com/Thumbnails/1/CC2595RGTR.jpg
Samacsys Pin Count：17Samacsys Part Category：Integrated Circuit
Samacsys Package Category：Quad Flat No-LeadSamacsys Footprint Name：RGT
Samacsys Released Date：2020-04-10 02:39:50Is Samacsys：N
JESD-30 代码：S-PQCC-N16JESD-609代码：e4
长度：3 mm湿度敏感等级：2
功能数量：1端子数量：16
最高工作温度：85 °C最低工作温度：-40 °C
封装主体材料：PLASTIC/EPOXY封装代码：HVQCCN
封装等效代码：LCC16,.12SQ,20封装形状：SQUARE
封装形式：CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE峰值回流温度（摄氏度）：260
电源：3 V认证状态：Not Qualified
座面最大高度：1 mm子类别：Other Telecom ICs
标称供电电压：3 V表面贴装：YES
电信集成电路类型：TELECOM CIRCUIT温度等级：INDUSTRIAL
端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)端子形式：NO LEAD
端子节距：0.5 mm端子位置：QUAD
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：3 mm
Base Number Matches：1

CC2595RGTR 数据手册

 浏览型号CC2595RGTR的Datasheet PDF文件第4页浏览型号CC2595RGTR的Datasheet PDF文件第5页浏览型号CC2595RGTR的Datasheet PDF文件第6页浏览型号CC2595RGTR的Datasheet PDF文件第8页浏览型号CC2595RGTR的Datasheet PDF文件第9页浏览型号CC2595RGTR的Datasheet PDF文件第10页 
PACKAGE OPTION ADDENDUM  
www.ti.com  
19-Jan-2012  
PACKAGING INFORMATION  
Status (1)  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
CC2595RGTR  
ACTIVE  
QFN  
RGT  
16  
250  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-2-260C-1 YEAR  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
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