Datasheet > C3-10N-10

C3-10N-10

更新时间： 2024-02-01 07:04:03

品牌	Logo	应用领域
SUPERWORLD		电感器
页数	文件大小	规格书
9页	376K
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CERAMIC CHIP INDUCTORS

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C3-10N-10 数据手册

CERAMIC CHIP INDUCTORS

C3 SERIES

9. SOLDERING AND MOUNTING :

9-1. Recommended PC Board Pattern

3.00

PC board should be designed so that products are not sufficient

under mechanical stress as warping the board.

1.00

Products shall be positioned in the sideway direction against

the mechanical stress to prevent failure.

9-2. Soldering

Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused

by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all

wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot

air soldering tools.

9-2.1 Lead Free Solder Re-flow :

Recommended temperature profiles for re-flow soldering in Figure 1.

9-2.2 Solder Wave :

Wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature

seen by the circuit when immersed in the molten solder wave. Due to the risk of thermal damage to products, wave

soldering of large size products is discouraged. Recommended temperature profile for wave soldering is shown

in Fig. 2

9-2.3 Soldering Iron (Figure 3) :

Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that

a soldering iron must be employed the following precautions are recommended.

Note :

a) Preheat circuit and products to 150°C.

b) 350°C tip temperature (max)

c) Never contact the ceramic with the iron tip

d) 1.0mm tip diameter (max)

e) Use a 20 watt soldering iron with tip diameter of 1.0mm

f) Limit soldering time to 3 secs.

Preheating

Soldering

20~40s

Natural

cooling

Preheating

Soldering

Natural

cooling

260

TP(260°C/10s max.)

217

245

150

200

150

60~150s

60~180s

480s max.

Gradual

Cooling

Time(sec.)

Over 2min.

Figure 1. Re-flow Soldering

Within 3s

Preheating

Soldering

Natural

cooling

Figure 2. Wave Soldering

(max.)

350

10s

(max.)

330

150

Gradual

Cooling

Over 1min.

Figure 3. Hand Soldering

NOTE : Specifications subject to change without notice. Please check our website for latest information.

07.08.2008

SUPERWORLD ELECTRONICS (S) PTE LTD

PG. 6

1...3 4 567 8 9

中文翻译

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与C3-10N-10相关器件

型号	品牌	获取价格	描述	数据表
C3-10NJ-10	SUPERWORLD	获取价格	Length (mm): 2.00 \| Width (mm): 1.25 \| Height (mm): 0.85 \| SPQ (reel) : 4000 Design of mul
C310QA-25.000M	ETC	获取价格	MILITARY STANDARD HIGH TEMPERATURE OSCILLATORS
C310QA-25000M	ETC	获取价格	MILITARY STANDARD HIGH TEMPERATURE OSCILLATORS
C310QB-25.000M	ETC	获取价格	MILITARY STANDARD HIGH TEMPERATURE OSCILLATORS
C310QB-25000M	ETC	获取价格	MILITARY STANDARD HIGH TEMPERATURE OSCILLATORS
C310QC-25.000M	ETC	获取价格	MILITARY STANDARD HIGH TEMPERATURE OSCILLATORS
C310QC-25000M	ETC	获取价格	MILITARY STANDARD HIGH TEMPERATURE OSCILLATORS
C310RA-25.000M	ETC	获取价格	MILITARY STANDARD HIGH TEMPERATURE OSCILLATORS
C310RA-25000M	ETC	获取价格	MILITARY STANDARD HIGH TEMPERATURE OSCILLATORS
C310RB-25.000M	ETC	获取价格	MILITARY STANDARD HIGH TEMPERATURE OSCILLATORS

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