CERAMIC CHIP / HIGH VOLTAGE
CAPACITOR ORDERING INFORMATION
Capacitor Ordering Information
C
0805
C
102
K
C
R
A
C
SSttyyllee
C - Ceramic
Chip Size
Chip Size
0805; 1206; 1210; 1808;
1812; 1825; 2220; 2225
EEnndd MMeettaalllliizzaattiioonn
C = Standard
FFaaiilluurree RRaattee LLeevveell
Specification
Specification
A = Not Applicable
C - Standard
Capacitance Code, pF
Capacitance Code, pF
Temperature Characteristic
Temperature Characteristic
First two digits represent significant figures.
Third digit specifies number of zeros. 100 pF = 101.
(Use “9” for 1.0 through 9.9 pF)
Designated by Capacitance
Change over Temperature Range
G – (C0G) ( 30ppm/C) (-55°C +125°C)
R – X7R ( 15ꢀ) (-55°C +125°C)
(Use “8” for 0.1 through .99 pF)
Capacitance Tolerance
Capacitance Tolerance
Voltage
Voltage
C = 0.25pF*
D = 0.5pF*
F = 1ꢀ*
J = 5ꢀ
K = 10ꢀ
M = 20ꢀ
C = 500V
D = 1000V
F = 1500V
G = 2000V
Z = 2500V
H = 3000V
G = 2ꢀ*
* Contact KEMET Sales for availability.
ELECTRICAL PARAMETERS
Electrical Parameters
Property
Specification
C0G: 1 pF to 0.010 µF
X7R: 10ppFf to 0.22 µF
Capacitance
25°C, 1.0 0.2 Vrms, 1 kHz (1 MHz for ≤ 1000 pF (C0G only)
C0G: C*, D*, F*, G*, J, K, M
X7R: J, K, M
C0G: 0.1ꢀ Max
* Contact KEMET Sales for availability.
Cap Tolerance
DF
X7R: 2.5ꢀ Max
Voltage Ratings
500 V, 1000 V, 1500 V, 2000 V, 2500 V, 3000 V
Operating Temperature Range
25ºC IR @ 500V
From -55C to +125C
From -55ºC to +125ºC
100 GΩ or 1000 MΩ-µF, whichever is less
10 GΩ or 100 MΩ-µF, whichever is less
125ºC IR @ 500V
-55ºC TCC
X7R: + 15ꢀ
+125ºC TCC
C0G: + 30 ppm / ºC
150ꢀ of Rated Voltage for Rated Voltage <1000 V
120ꢀ of Rated Voltage for Rated Voltage >=1000V
Dielectric Strength
Ripple Current
Consult KEMET Sales Representative
MARKING
Marking
These chips are supplied unmarked. If required, they can be supplied LASER-marked at an extra cost.
Details on the marking format is located on page 97.
Packaging
PACKAGING
KEMET High Voltage Surface Mount MLCC are available packaged in tape and reel configuration, or bulk
bag as outlined on page 83. Please consult factory for waffle packaging options.
SOLDERING PROCESS
Soldering Process
The 0805 and 1206 case sizes are suitable for either reflow or wave soldering processes. Sizes 1210 and
larger should be limited to reflow soldering only. All sizes incorporate the standard KEMET barrier layer of
pure nickel with an overplating of pure tin (Sn) for excellent solderability and resistance to solder leaching of
the termination.
Recommended Solder Pad Dimensions
RECOMMENDED SOLDER PAD DIMENSIONS
T (Total Length)
S (Separation
W (Pad Width)
L (Pad Length)
Chip Size
mm
3.30
4.50
4.50
5.90
5.90
5.90
7.00
7.00
in.
mm
0.70
1.50
1.50
2.30
2.30
2.30
3.30
3.30
in.
mm
in.
mm
1.30
1.50
1.50
1.80
1.80
1.80
1.85
1.85
in.
0805
1206
1210
1808
1812
1825
2220
2225
0.130
0.177
0.177
0.232
0.232
0.232
0.276
0.276
0.028
0.059
0.059
0.091
0.091
0.091
0.130
0.130
1.60
2.00
2.90
2.40
3.70
6.90
5.50
6.80
0.063
0.079
0.114
0.094
0.146
0.272
0.217
0.268
0.051
0.059
0.059
0.071
0.071
0.071
0.073
0.073
84
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
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