Datasheet > C0201C103B1PA

C0201C103B1PA

更新时间： 2022-04-23 23:00:11

品牌	Logo	应用领域
基美 - KEMET		/
页数	文件大小	规格书
8页	1034K
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CERAMIC CHIP CAPACITORS

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C0201C103B1PA 数据手册

TANTALUM, CERAMIC AND

ALUMINUM CHIP CAPACITORS

Packaging Information

Performance Notes

1. Cover Tape Break Force: 1.0 Kg Minimum.

2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:

Tape Width

8 mm

Peel Strength

0.1 Newton to 1.0 Newton (10g to 100g)

12 mm

0.1 Newton to 1.3 Newton (10g to 130g)

The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier

tape shall be 165ꢀ to 180ꢀ from the plane of the carrier tape. During peeling, the carrier and/or cover tape

shall be pulled at a velocity of 300 10 mm/minute.

3. Reel Sizes: Molded tantalum capacitors are available on either 180 mm (7") reels (standard) or 330 mm (13")

reels (with C-7280). Note that 13” reels are preferred.

4. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes.

Refer to EIA-556.

Embossed Carrier Tape Configuration: Figure 1

Table 1 — EMBOSSED TAPE DIMENSIONS (Metric will govern)

Constant Dimensions — Millimeters (Inches)

Tape Size

D₀

P₀

P₂

T Max

T₁Max

8 mm

and

12 mm

1.5

+0.10 -0.0

(0.059

1.75 0.10

4.0 0.10

2.0 0.05

0.600

0.100

(0.069 0.004) (0.157 0.004) (0.079 0.002) (0.024)

(0.004)

+0.004, -0.0)

Variable Dimensions — Millimeters (Inches)

Tape Size

Pitch

B₁Max.

Note 1

D₁Min.

Note 2

P₁

R Min. T₂Max

Note 3

A₀B₀K₀

Note 4

8 mm

Single

4.4

1.0

3.5 0.05

4.0 0.10

25.0

2.5

8.0 0.30

(4 mm)

(0.173)

(0.039) (0.138 0.002) (0.157 0.004) (0.984) (0.098) (.315 0.012)

12 mm

Double

(8 mm)

8.2

(0.323)

1.5 5.5 0.05 8.0 0.10 30.0 4.6 12.0 0.30

(0.059) (0.217 0.002) (0.315 0.004) (1.181) (0.181) (0.472 0.012)

NOTES

1. B1 dimension is a reference dimension for tape feeder clearance only.

2. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of

embossment location and hole location shall be applied independent of each other.

3. Tape with components shall pass around radius “R” without damage (see sketch A). The minimum trailer length (Fig. 2) may require

additional length to provide R min. for 12 mm embossed tape for reels with hub diameters approaching N min. (Table 2)

4. The cavity defined by A₀, B₀, and K₀shall be configured to surround the part with sufficient clearance such that the chip does not pro-

trude beyond the sealing plane of the cover tape, the chip can be removed from the cavity in a vertical direction without mechanical

restriction, rotation of the chip is limited to 20 degrees maximum in all 3 planes, and lateral movement of the chip is restricted to 0.5 mm

maximum in the pocket (not applicable to vertical clearance.)

©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300

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