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C-129-155C-FDFB-SLC5S-G5 PDF预览

C-129-155C-FDFB-SLC5S-G5

更新时间： 2024-02-15 07:50:35
品牌 Logo 应用领域
SOURCE 光纤通信
页数 文件大小 规格书
8页 670K
描述
155 Mbps Single Mode SFF LC Transceiver

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C-129-155C-FDFB-SLC5S-G5 技术参数

是否无铅： 含铅是否Rohs认证： 不符合
生命周期：ActiveReach Compliance Code：unknown
风险等级：5.82Is Samacsys：N
其他特性：2 X 5 ARRAY, IT ALSO OPERATES FROM 1100 NM TO 1620 NM主体宽度：13.6 mm
主体高度：9.8 mm主体长度或直径：48.8 mm
通信标准：GR-468, OC-3, SDH, SONET, STM-1连接类型：LC CONNECTOR
数据速率（接收）：155 Mbps数据速率（发送）：155 Mbps
发射极/检测器类型：LASER DIODE光纤设备类型：TRANSCEIVER
光纤类型：SMF安装特点：BOARD/PANEL MOUNT
最高工作温度：70 °C最低工作温度：
最大工作波长：1298 nm最小工作波长：1285 nm
标称工作波长：1290 nm标称光功率输出：0.562 mW
灵敏度：-35 dBm最大供电电压：3.5 V
最小供电电压：3.1 V标称供电电压：3.3 V
表面贴装：NOBase Number Matches：1

C-129-155C-FDFB-SLC5S-G5 数据手册

 浏览型号C-129-155C-FDFB-SLC5S-G5的Datasheet PDF文件第2页浏览型号C-129-155C-FDFB-SLC5S-G5的Datasheet PDF文件第3页浏览型号C-129-155C-FDFB-SLC5S-G5的Datasheet PDF文件第4页浏览型号C-129-155C-FDFB-SLC5S-G5的Datasheet PDF文件第5页浏览型号C-129-155C-FDFB-SLC5S-G5的Datasheet PDF文件第7页浏览型号C-129-155C-FDFB-SLC5S-G5的Datasheet PDF文件第8页 
155 Mbps Single Mode SFF LC Transceiver  
C-1XX-155(C)-FDFB-SLCX  
Printed Circuit Board Layout Consideration  
A fiber-optic receiver employs a very high gain, wide bandwidth transimpedance amplifier. This amplifier detects and amplifies  
signals that are only tens of nA in amplitude when the receiver is operating near it’s limit. Any unwanted signal current that couples into the  
receiver circuitry causes a decrease in the receiver’s sensitivity and can also degrade the performance of the receiver’s signal detect (SD) circuit.  
To minimize the coupling of unwanted noise into the receiver, careful attention must be given to the printed circuit board.  
At a minimum, a double-sided printed circuit board(PCB) with a large component side ground plane beneath the transceiver must  
be used. In applications that include many other high speed devices, a multi-layer PCB is highly recommended. This permits the placement of  
power and ground on separate layers, wich allows them to be isolated from the signal lines. Multilayer construction also permits the routing of  
signal traces away from high level, high speed sinal lines. To minimize the possibility of coupling noise into the receiver section, high level, high  
speed signals such as transmitter inputs and clock lines should be routed as far away as possible from the receiver pins.  
Noise that couples into the receiver through the power supply pins can also degrade performance. It is recommended that a pi filter  
be used in both transmitter and receiver power supplies.  
EMI and ESC Consideration  
LuminentOIC transceivers offer a metalized plastic case and a special chassis grounding clip. As shown in the drawing, this clip connects  
the module case to chassis ground then installs flush through the panel cutout. This way, the grounding clip brushes the edge of the cutout in  
order to make a proper contact. The use of a grounding clip also provides increased electrostatic protection and helps reduce radiated emission  
from the module or the host circuit board through the chassis faceplate. The attaching posts are at case potential and may be connected to chassis  
ground. They should not be connected to circuit ground.  
Plastic optical subassemblies are used to further reduce the possibility of radiated emission by eliminating the metal from the  
transmitter and receiver diode housings, which extend into connector space. By providing a non-metal receptacle for the optical cable ferrule, the  
gigabit speed RF electrical signal is isolated from the connector area thus preventing radiated energy leakage from these surfaces to the outside of  
the panel.  
20550 Nordhoff St. • Chatsworth, CA 91311 • tel: 818.773.9044 • fax: 818.576.9486  
9F, No 81, Shui Lee Rd. • Hsinchu, Taiwan, R.O.C. • tel: 886.3.5169222 • fax: 886.3.5169213  
LUMINENTOIC.COM  
LUMNDS850-Apr0706  
Rev A.2  
6
1...345678

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