M C C
BZT52C2V4S
THRU
BZT52C39S
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents
20736 Marilla Street Chatsworth
ꢆꢋꢅꢌꢍꢎꢍꢍ
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ
$ꢉ%ꢒꢅ ꢅ ꢅ ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ
TM
Micro Commercial Components
Features
xꢀ Planar Die Construction
200 mW
Zener Diode
2.4 to 39 Volts
xꢀ 200mW Power Dissipation on Ceramic PCB
xꢀ General Purpose Medium Current
xꢀ Ideally Suited for Automated Assembly Processes
·
Epoxy meets UL 94 V-0 flammability rating
·
•
Moisture Sensitivity Level 1
Lead Free Finish/RoHS Compliant("P" Suffix
designates RoHS Compliant. See ordering information)
SOD-323
A
B
Absolute Maximum Ratings
Symbol
Parameter
Rating
200
Unit
mW
к
PD
Power dissipation
C
E
TJ
Junction Temperature
-65 to +150
-65 to +150
к
TSTG
Storage Temperature Range
H
D
J
G
Absolute Maximum Ratings
DIMENSIONS
Symbol
Parameter
Rating
Unit
DIM
INCHES
MIN
MM
NOTE
Thermal Resistance Junction to
Ambient*
к/W
RthJA
625
MAX
.107
.071
.053
.045
.016
.018
.010
.006
MIN
2.30
1.60
1.15
0.80
0.25
0.10
0.10
-----
MAX
2.70
1.80
1.35
1.15
0.40
0.45
0.25
0.15
A
B
C
D
E
G
H
J
.090
.063
.045
.031
.010
.004
.004
-----
* Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with
pad areas 25 mm2
Electrical Characteristics
Symbol
Parameter
Rating
Unit
SUGGESTED SOLDER
PAD LAYOUT
Maximum Forward Voltage
(IF=10mAdc)
0.074"
VF
0.9
V
0.027”
0.022”
www.mccsemi.com
1 of 3
Revision: A
2011/01/01