BQ25180
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ZHCSPC2C –SEPTEMBER 2021 –REVISED JANUARY 2023
Table of Contents
8.4 Device Functional Modes..........................................25
8.5 Register Maps...........................................................26
9 Application and Implementation..................................41
9.1 Application Information............................................. 41
9.2 Typical Application.................................................... 41
10 Power Supply Recommendations..............................48
11 Layout...........................................................................49
11.1 Layout Guidelines................................................... 49
11.2 Layout Example...................................................... 49
12 Device and Documentation Support..........................50
12.1 Device Support....................................................... 50
12.2 接收文档更新通知................................................... 50
12.3 支持资源..................................................................50
12.4 Trademarks.............................................................50
12.5 静电放电警告.......................................................... 50
12.6 术语表..................................................................... 50
13 Mechanical, Packaging, and Orderable
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 说明（续）.........................................................................3
6 Pin Configuration and Functions...................................4
7 Specifications.................................................................. 5
7.1 Absolute Maximum Ratings........................................ 5
7.2 ESD Ratings............................................................... 5
7.3 Thermal Information....................................................5
7.4 Recommended Operating Conditions.........................5
7.5 Electrical Characteristics.............................................6
7.6 Timing Requirements................................................10
7.7 Typical Characteristics.............................................. 11
8 Detailed Description......................................................12
8.1 Overview...................................................................12
8.2 Functional Block Diagram.........................................16
8.3 Feature Description...................................................16
Information.................................................................... 51
4 Revision History
注：以前版本的页码可能与当前版本的页码不同
Changes from Revision B (January 2022) to Revision C (January 2023)
Page
• Removed figure from 节8.3.1 ..........................................................................................................................16
Changes from Revision A (December 2021) to Revision B (January 2022)
Page
• Removed operating ambient...............................................................................................................................5
• Removed OTP_VLOWV.....................................................................................................................................6
• Removed Standalone......................................................................................................................................... 6
• Removed /PG Isink.............................................................................................................................................6
• Removed tHW_RESET and FI2C_CLK ....................................................................................................................10
• Updated conditions for Typical Characteristics ................................................................................................ 11
• Added legend for 图7-1 ...................................................................................................................................11
• Changed 图8-4 and 图8-5 ..............................................................................................................................21
• Changed MR input to Pushbutton input in 表8-6 ............................................................................................ 25
• Updated Section 8.5 Register Maps reset values.............................................................................................26
• Changed Device_ID description in the 表8-21 ................................................................................................26
Changes from Revision * (September 2021) to Revision A (December 2021)
Page
• 将“预告信息”更改为“量产数据”.................................................................................................................. 1
Copyright © 2023 Texas Instruments Incorporated
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