Datasheet > BD820F50EFJ-C

BD820F50EFJ-C

更新时间： 2023-09-03 20:25:15

品牌	Logo	应用领域
罗姆 - ROHM		复位电路电容器稳压器
页数	文件大小	规格书
41页	1259K
描述
BD820F50EFJ-C是45V高耐压稳压器，内置监视其输出的复位电路(RESET)及看门狗计时器(WDT)。输出电流能力为200mA，但待机电流很小，适合用来降低系统的消耗电流。稳压器输出低于4.2V(Typ)时输出复位信号。复位延迟时间、看门狗计时器监视时间可通过外置电容器进行调整。We recommend BD820F5UEFJ-C for your new development. It uses different production lines for the purpose of improving production efficiency. Electric characteristics noted in Datasheet does not differ between Production Line.

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BD820F50EFJ-C 数据手册

BD820F50EFJ-C BD820F5UEFJ-C

Absolute Maximum Ratings

Parameter

Symbol

V_CC

Ratings

-0.3 to +45.0

Unit

Supply Voltage^{(Note 1)}

CT Voltage

V_CT

-0.3 to +7.0 (≤ V_O+ 0.3)

-0.3 to +7.0

CLK Voltage

V_CLK

V_INH

V_RO

INH Voltage

-0.3 to +7.0

RO Voltage

-0.3 to +20.0

Output Voltage

V_O

-0.3 to +20.0 (≤ V_CC+ 0.3)

-40 to +150

Junction Temperature Range

Storage Temperature Range

Maximum Junction Temperature

°C

Tstg

Tjmax

-55 to +150

+150

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with power dissipation and thermal resistance taken into

consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating.

(Note 1) Do not exceed Tjmax.

Thermal Resistance^{(Note 2)}

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s^{(Note 4)}

2s2p^{(Note 5)}

HTSOP-J8

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 3)}

θ_JA

130

°C/W

Ψ_JT

(Note 2) Based on JESD51-2A(Still-Air), using a BD820F50EFJ-C Chip.

(Note 3) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside

surface of the component package.

(Note 4) Using a PCB board based on JESD51-3.

(Note 5) Using a PCB board based on JESD51-5, 7.

Layer Number of

Measurement Board

Material

FR-4

Board Size

Single

114.3 mm x 76.2 mm x 1.57 mmt

Top

Copper Pattern

Thickness

70 μm

Footprints and Traces

Layer Number of

Measurement Board

Thermal Via^{(Note 6)}

Material

FR-4

Board Size

114.3 mm x 76.2 mm x 1.6 mmt

2 Internal Layers

Pitch

Diameter

4 Layers

1.20 mm

Φ0.30 mm

Top

Copper Pattern

Bottom

Thickness

70 μm

Copper Pattern

Thickness

35 μm

Copper Pattern

Thickness

70 μm

Footprints and Traces

74.2 mm x 74.2 mm

(Note 6) This thermal via connects with the copper pattern of all layers.

.www.rohm.com

TSZ22111 • 15 • 001

TSZ02201-0JAJ0AN00020-1-2

9.Nov.2021 Rev.002

7/38

1...4 5 678 9 10...41

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