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BC182_03 PDF预览

BC182_03

更新时间: 2022-04-23 23:00:11
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 放大器
页数 文件大小 规格书
4页 61K
描述
NPN General Purpose Amplifier

BC182_03 数据手册

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BC182, BC182B  
Amplifier Transistors  
NPN Silicon  
Features  
http://onsemi.com  
These are Pb−Free Devices*  
COLLECTOR  
1
2
BASE  
MAXIMUM RATINGS  
3
Rating  
CollectorEmitter Voltage  
CollectorBase Voltage  
EmitterBase Voltage  
Symbol  
Value  
50  
Unit  
Vdc  
EMITTER  
V
CEO  
V
CBO  
V
EBO  
60  
Vdc  
6.0  
Vdc  
TO−92  
CASE 29  
STYLE 17  
Collector Current − Continuous  
I
100  
mAdc  
C
Total Device Dissipation @ T = 25°C  
P
350  
2.8  
mW  
mW/°C  
A
D
Derate above 25°C  
1
Total Device Dissipation @ T = 25°C  
P
D
1.0  
8.0  
W
mW/°C  
1
C
2
2
3
Derate above 25°C  
3
STRAIGHT LEAD  
BULK PACK  
BENT LEAD  
TAPE & REEL  
AMMO PACK  
Operating and Storage Junction  
Temperature Range  
T , T  
−55 to +150  
°C  
J
stg  
THERMAL CHARACTERISTICS  
Characteristic  
MARKING DIAGRAM  
Symbol  
Max  
357  
125  
Unit  
°C/W  
°C/W  
Thermal Resistance, Junction−to−Ambient  
Thermal Resistance, Junction−to−Case  
R
q
JA  
JC  
R
q
BC  
182B  
AYWW G  
G
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
A
Y
= Assembly Location  
= Year  
WW  
= Work Week  
G
= Pb−Free Package  
(Note: Microdot may be in either location)  
ORDERING INFORMATION  
Device  
BC182G  
Package  
Shipping  
TO−92  
(Pb−Free)  
5000 Units / Bulk  
5000 Units / Bulk  
2000 / Tape & Reel  
BC182BG  
TO−92  
(Pb−Free)  
BC182BRL1G  
TO−92  
(Pb−Free)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
© Semiconductor Components Industries, LLC, 2007  
1
Publication Order Number:  
March, 2007 − Rev. 5  
BC182/D  

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