BC182, BC182B
Amplifier Transistors
NPN Silicon
Features
http://onsemi.com
• These are Pb−Free Devices*
COLLECTOR
1
2
BASE
MAXIMUM RATINGS
3
Rating
Collector−Emitter Voltage
Collector−Base Voltage
Emitter−Base Voltage
Symbol
Value
50
Unit
Vdc
EMITTER
V
CEO
V
CBO
V
EBO
60
Vdc
6.0
Vdc
TO−92
CASE 29
STYLE 17
Collector Current − Continuous
I
100
mAdc
C
Total Device Dissipation @ T = 25°C
P
350
2.8
mW
mW/°C
A
D
Derate above 25°C
1
Total Device Dissipation @ T = 25°C
P
D
1.0
8.0
W
mW/°C
1
C
2
2
3
Derate above 25°C
3
STRAIGHT LEAD
BULK PACK
BENT LEAD
TAPE & REEL
AMMO PACK
Operating and Storage Junction
Temperature Range
T , T
−55 to +150
°C
J
stg
THERMAL CHARACTERISTICS
Characteristic
MARKING DIAGRAM
Symbol
Max
357
125
Unit
°C/W
°C/W
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
R
q
JA
JC
R
q
BC
182B
AYWW G
G
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
A
Y
= Assembly Location
= Year
WW
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
†
Device
BC182G
Package
Shipping
TO−92
(Pb−Free)
5000 Units / Bulk
5000 Units / Bulk
2000 / Tape & Reel
BC182BG
TO−92
(Pb−Free)
BC182BRL1G
TO−92
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2007
1
Publication Order Number:
March, 2007 − Rev. 5
BC182/D