NTC thermistors for temperature measurement
Probe assemblies
B58703M1103A00*
M1703
Cautions and warnings
Do not apply continuous pull-force between sensor and wire ends. Pull force requirement of 50 N is
for short-term mounting conditions only. Consider metal compliance when mounting the sensor. Brass
is not suitable for mounting sensor to an aluminum surface as contact corrosion may occur.
Storage
Store thermistors only in original packaging. Do not open the package prior to storage.
Storage conditions in original packaging: storage temperature −10 °C ... +45 °C, relative humidity
45% up to 75% annual mean, <95% maximum 30 days per annum, dew precipitation is
inadmissible.
Do not store thermistors where they are exposed to heat or direct sunlight. Otherwise, the packing
material may be deformed or components may stick together, causing problems during mounting.
Avoid contamination of thermistor surface during storage, handling and processing.
Avoid storage of thermistors in harmful environments like corrosive gases (SOx, Cl etc).
Use the components as soon as possible after opening the factory seals, i.e. the polyvinyl-sealed
packages.
Crimping the wire ends is permissible until 36 months after delivery because the formed oxide
layer is destroyed during the crimping process. Insulation decelerates the oxidation of copper, so
the wires ends must be stripped directly prior crimping.
Soldering or welding the wire ends is only permissible within 6months after delivery.
Handling
NTC thermistors must not be dropped. Chip-offs or any other damage must not be caused during
handling of NTCs.
Avoid contamination of thermistor surface during handling. Gloves are recommended.
Washing processes may damage the product due to the possible static or cyclic mechanical loads
(e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts, which
might lead to reduced reliability or lifetime.
Bending/ twisting leads
A lead (wire) may be bent at a minimum distance of twice the wire’s diameter plus 4 mm from the
component head or housing. When bending ensure the wire is mechanically relieved at the
component head or housing. The bending radius should be at least 0.75 mm.
Soldering
Use resin-type flux or non-activated flux.
Insufficient preheating may cause ceramic cracks.
Rapid cooling by dipping in solvent is not recommended.
Complete removal of flux is recommended.
TPS NTC PD S
2019-09-23
Please read Cautions and warnings and
Page 7 of 10
Important notes at the end of this document.
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