Pressure sensors
Gauge pressure transducers
AK2 series
Cautions and warnings
Storage (general)
All pressure sensors should be stored in their original packaging. They should not be placed in harmful environments such
as corrosive gases nor exposed to heat or direct sunlight, which may cause deformations. Similar effects may result from
extreme storage temperatures and climatic conditions. Avoid storing the sensor dies in an environment where condensation
may form or in a location exposed to corrosive gases, which will adversely affect their performance. Plastic materials should
not be used for wrapping/packing when storing or transporting these dies, as they may become charged. Pressure sensor
dies should be used soon after opening their seal and packaging.
Operation (general)
Media compatibility with the pressure sensors must be ensured to prevent their failure. The use of other media can cause
damage and malfunction. Never use pressure sensors in atmospheres containing explosive liquids or gases.
Ensure pressure equalization to the environment, if gauge pressure sensors are used. Avoid operating the pressure sensors
in an environment where condensation may form or in a location exposed to corrosive gases. These environments adversely
affect their performance.
If the operating pressure is not within the rated pressure range, it may change the output characteristics. This may also
happen with pressure sensor dies if an incorrect mounting method is used. Be sure that the applicable pressure does not
exceed the overpressure, as it may damage the pressure sensor.
Do not exceed the maximum rated supply voltage nor the rated storage temperature range, as it may damage the pressure
sensor.
Temperature variations in both the ambient conditions and the media (liquid or gas) can affect the accuracy of the output
signal from the pressure sensors. Be sure to check the operating temperature range and thermal error specification of the
pressure sensors to determine their suitability for the application.
Connections must be wired in accordance with the terminal assignment specified in the data sheets. Care should be taken
as reversed pin connections can damage the pressure transmitters or degrade their performance. Contact between the
pressure sensor terminals and metals or other materials may cause errors in the output characteristics.
Design notes (dies)
This specification describes the mechanical, electrical and physical requirements of a piezoresistive sensor die for
measuring pressure. The specified parameters are valid for the pressure sensor die with pressure application either to the
front or back side of the diaphragm as described in the data sheet. Pressure application to the other side may result in
differing data. Most of the parameters are influenced by assembly conditions. Hence these parameters and the reliability
have to be specified for each specific application and tested over its temperature range by the customer.
Handling/Mounting (dies)
Pressure sensor dies should be handled appropriately and not be touched with bare hands. They should only be picked up
manually by the sides using tweezers. Their top surface should never be touched with tweezers. Latex gloves should not be
used for handling them, as this will inhibit the curing of the adhesive used to bond the die to the carrier. When handling, be
careful to avoid cuts caused by the sharp-edged terminals. The sensor die must not be contaminated during manufacturing
processes (gluing, soldering, silk-screen process).
The package of pressure sensor dies should not to be opened until the die is mounted and should be closed after use. The
sensor die must not be cleaned. The sensor die must not be damaged during the assembly process (especially scratches on
the diaphragm).
Soldering (transducers, transmitters)
The thermal capacity of pressure sensors is normally low, so steps should be taken to minimize the effects of external heat.
High temperatures may lead to damage or changes in characteristics.
A non-corrosive type of flux resin should normally be used and complete removal of the flux is recommended.
Avoid rapid cooling due to dipping in solvent. Note that the output signal may change if pressure is applied to the terminals
during soldering.
This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.
AS SEN PD
2009-08-03
Please read Cautions and warnings and
Page 6 of 7
Important notes at the end of this document.
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