Datasheet > B58601E3214B711

B58601E3214B711

更新时间： 2024-03-03 10:09:29

品牌	Logo	应用领域
东电化 - TDK		/
页数	文件大小	规格书
10页	446K
描述
Pressure sensor die, low pressure, open bridge, high TCR

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B58601E3214B711 数据手册

Important notes

8. The trade names EPCOS, CarXield, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas,

CSMP, CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell,

MKD, MKK, ModCap, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap,

PQSine, PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV,

ThermoFuse, WindCap, XieldCap are trademarks registered or pending in Europe and in other

countries.

Further

information

will

found

the

Internet

www.tdk-electronics.tdk.com/trademarks.

Release 2020-06

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型号	品牌	描述	获取价格	数据表
B58601E3215B497	TDK	Pressure sensor die	获取价格
B58601E3215B615	TDK	Pressure sensor die, open bridge	获取价格
B58601E3215B646	TDK	Pressure sensor die, open bridge	获取价格
B58601E3215B709	TDK	Pressure sensor die, open bridge, high TCR	获取价格
B58601E3215B711	TDK	Pressure sensor die, open bridge, high TCR	获取价格
B58601E3224B497	TDK	Pressure sensor die	获取价格