Datasheet > B57702M0103J000

B57702M0103J000

更新时间： 2024-03-03 10:11:14

品牌	Logo	应用领域
东电化 - TDK		/
页数	文件大小	规格书
8页	314K
描述
Nominal Resistance=10kΩ

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数据手册

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B57702M0103J000 数据手册

NTC thermistors for temperature measurement

Probe assemblies

B57702M0103J000

M702/10K/J

Cautions and warnings

Storage

•

Store thermistors only in original packaging. Do not open the package prior to storage.

Storage conditions in original packaging: storage temperature −25 °C ... +45 °C, relative humidity

≤75% annual mean, <95% maximum 30 days per annum, dew precipitation is inadmissible.

Do not store thermistors where they are exposed to heat or direct sunlight. Otherwise, the packing

material may be deformed or components may stick together, causing problems during mounting.

Avoid contamination of thermistor surface during storage, handling and processing.

Avoid storage of thermistors in harmful environments like corrosive gases (SOx, Cl etc).

Use the components as soon as possible after opening the factory seals, i.e. the polyvinyl-sealed

packages.

•

Solder thermistors within the time specified after shipment.

For leaded components this is 24 months.

Handling

•

NTC thermistors must not be dropped. Chip-offs or any other damage must not be caused during

handling of NTCs.

•

Do not touch components with bare hands. Gloves are recommended.

Avoid contamination of thermistor surface during handling.

Washing processes may damage the product due to the possible static or cyclic mechanical loads

(e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts, which

might lead to reduced reliability or lifetime.

Bending/Twisting

•

Bending on wire is permitted at a minimum distance of twice the wire's diameter plus 4 mm from

the component head or housing. When bending ensure the wire is mechanically relieved at the

component head or housing. The bending radius should be at least eight times the wire's

diameter.

•

Twisting is prohibited as it may cause cracks and or reduce bonding between insulation and

coating/potting material.

Soldering

•

Use resin-type flux or non-activated flux.

Insufficient preheating may cause ceramic cracks.

Rapid cooling by dipping in solvent is not recommended.

Complete removal of flux is recommended.

BT TPS PD

2021-10-15

Please read Cautions and warnings and

Page 5 of 8

Important notes at the end of this document.

1 2 3 456 7 8

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