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B048L120T20 PDF预览

B048L120T20

更新时间: 2024-02-09 04:30:45
品牌 Logo 应用领域
VICOR 输入元件
页数 文件大小 规格书
16页 516K
描述
Analog Circuit, 1 Func, Hybrid, MODULE, BGA-106

B048L120T20 技术参数

生命周期:Obsolete零件包装代码:BGA
包装说明:,针数:106
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.84其他特性:INPUT VOLTAGE RANGE IS 42V TO 53V
模拟集成电路 - 其他类型:ANALOG CIRCUITJESD-30 代码:R-XXMA-X106
功能数量:1端子数量:106
最高工作温度:125 °C最低工作温度:-40 °C
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:MICROELECTRONIC ASSEMBLY认证状态:Not Qualified
最大供电电压 (Vsup):5.2 V最小供电电压 (Vsup):4.8 V
标称供电电压 (Vsup):5 V表面贴装:NO
技术:HYBRID温度等级:AUTOMOTIVE
端子形式:UNSPECIFIED端子位置:UNSPECIFIED
Base Number Matches:1

B048L120T20 数据手册

 浏览型号B048L120T20的Datasheet PDF文件第3页浏览型号B048L120T20的Datasheet PDF文件第4页浏览型号B048L120T20的Datasheet PDF文件第5页浏览型号B048L120T20的Datasheet PDF文件第7页浏览型号B048L120T20的Datasheet PDF文件第8页浏览型号B048L120T20的Datasheet PDF文件第9页 
PRELIMINARY  
Specifications, continued  
THERMAL  
Symbol  
Parameter  
Min  
Typ  
130  
0.61  
Max  
Unit  
°C  
Note  
Over temperature shutdown  
Thermal capacity  
125  
135  
Junction temperature  
Ws/°C  
RθJC  
RθJB  
RθJA  
RθJA  
Junction-to-case thermal impedance  
Junction-to-BGA thermal impedance  
Junction-to-ambient1  
1.1  
2.1  
6.5  
5.0  
1.5  
2.5  
7.2  
5.5  
°C/W  
°C/W  
°C/W  
°C/W  
Junction-to-ambient2  
Notes  
1. B048K120T20 surface mounted in-board to a 2" x 2" FR4 board, 8 oz Cu total, 300 LFM.  
2. B048L120T20 (0.25"H integral Pin Fins) surface mounted on FR4 board, 300 LFM.  
V•I CHIP STRESS DRIVEN PRODUCT QUALIFICATION PROCESS  
Test  
Standard  
Environment  
High Temperature Operational Life (HTOL)  
Temperature Cycling  
JESD22-A-108-B  
JESD22-A-104B  
JESD22-A-103A  
JESD22-A113-B  
EIA/JESD22-A-101-B  
JESD22-A-102-C  
JESD22-A-110B  
JESD22-B-107-A  
JESD22-B-103-A  
JESD22-B-104-A  
EIA/JESD22-A114-A  
EIA/JESD22-A115-A  
Per Vicor Internal  
Test Specification  
125°C, Vmax, 1,008 hrs  
-55°C to 125°C, 1,000 cycles  
High Temperature Storage  
150°C, 1,000 hrs  
Moisture Resistance  
Moisture Sensitivity Level 4  
Temperature Humidity Bias Testing (THB)  
Pressure Cooker Testing (Autoclave)  
Highly Accelerated Stress Testing (HAST)  
Solvent Resistance/Marking Permanency  
Mechanical Vibration  
85°C, 85% RH, Vmax, 1,008 hrs  
121°C, 100% RH, 15 PSIG, 96 hrs  
130°C, 85% RH, Vmax, 96 hrs  
Solvents A, B & C as defined  
20g peak, 20-2,000 Hz, test in X, Y & Z directions  
1,500g peak 0.5 ms pulse duration, 5 pulses in 6 directions  
Meets or exceeds 2,000 Volts  
Meets or exceeds 200 Volts  
Mechanical Shock  
Electro Static Discharge Testing – Human Body Model  
Electro Static Discharge Testing – Machine Model  
Highly Accelerated Life Testing (HALT)  
Operation limits verified, destruct margin determined  
Per Vicor Internal  
Test Specification  
Dynamic Cycling  
Constant line, 0-100% load,  
-20°C to 125°C  
V•I CHIP BALL GRID ARRAY INTERCONNECT QUALIFICATION  
Test  
Standard  
Environment  
IPC-SM-785  
IPC-9701  
TC3, -40 to 125°C at <10 °C/min,  
10 min dwell time.  
BGA Daisy-Chain Thermal Cycling  
IPC-9701  
Ball Shear  
Bend Test  
No failure through intermetallic.  
Deflection through 4 mm.  
IPC J-STD-029  
IPC J-STD-029  
Vicor Corporation  
Tel: 800-735-6200  
vicorpower.com  
V•I Chip Bus Converter  
B048K120T20  
Rev. 1.7  
Page 6 of 16  
45  

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