Datasheet > B0225J7575AHF

B0225J7575AHF

更新时间： 2023-12-06 20:02:01

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B0225J7575AHF 数据手册

B0225J7575AHF

Rev E

Mounting Configuration:

In order for Xinger surface mount components to work optimally, the proper impedance transmission lines

must be used to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and

VSWR may not meet published specifications.

All of the Xinger components are constructed from organic PTFE based composites which possess excellent

electrical and mechanical stability. Xinger components are compliant to a variety of ROHS and Green

standards and ready for Pb-free soldering processes. Pads are Gold plated with a Nickel barrier.

An example of the PCB footprint used in the testing of these parts is shown below. In specific designs, the

transmission line widths need to be adjusted to the unique dielectric coefficients and thicknesses as well as

varying pick and place equipment tolerances.

Circuit Pattern

Dimensions are in Millimeters

Mounting Footprint

Footprint Pad (s)

Solder Resist

Plated thru holes to ground

6x .41

4x .25

3x Transmission

lines

.04

6x .33

.66

1 2 345

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