B0110E50200AHF
Rev F
Distortion Considerations:
This balun does NOT contain any ferrite materials and are as such distortion free. Very, very low levels of
distortion can arise from dissimilar metals on the contact pads of the part (Cu-Ni-Au) and from inter-metallic
contaminations within the part
Mounting Configuration:
In order for Xinger surface mount components to work optimally, the proper impedance transmission lines
must be used to connect to the RF ports. If this condition is not satisfied, insertion loss, Isolation and VSWR
may not meet published specifications.
All of the Xinger components are constructed from organic PTFE based composites, which possess
excellent electrical and mechanical stability. Xinger components are compliant to a variety of ROHS and
Green standards and ready for Pb-free soldering processes. Pads are Gold plated with a Nickel barrier.
To supply common mode voltage offset to the analog-to-digital converter, DC blocking capacitors are
needed at the balanced port (pins 6 & 8).
An example of the PCB footprint used in the testing of these parts is shown below. In specific designs, the
transmission line widths need to be adjusted to the unigue dieletric coefficients and thickness as well as
varying pick and place equipment tolerances. In addition, two external 0402 capacitors must be mounted in
locations C1 and C2 shown in the figure below to get the performance specified in the datasheet.
.06
0402 Capacitor
Plated thru
hole(s) to
Ground
.06
Part Orientation
(Top View)
0402 Capacitor
4x .22
10x .28
3x Transmission Line
6x .29
10x .36
4x .15
Circuit Pattern
Footprint Pad(s)
Solder Resist
External Component Footprint
Dimensions are in millimeters
4