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AU5790D14/N,112 PDF预览

AU5790D14/N,112

更新时间: 2024-02-05 17:55:11
品牌 Logo 应用领域
恩智浦 - NXP 光电二极管
页数 文件大小 规格书
20页 120K
描述
IC DATACOM, INTERFACE CIRCUIT, PDSO14, PLASTIC, SO-14, Network Interface

AU5790D14/N,112 数据手册

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Philips Semiconductors  
Product data  
Single wire CAN transceiver  
AU5790  
T =T + P * θ  
ja  
THERMAL CHARACTERISTICS  
j
a
d
The AU5790 provides protection from thermal overload. When the  
IC junction temperature reaches the threshold (155 °C), the  
AU5790 will disable the transmitter drivers, reducing power  
dissipation to protect the device. The transmit function will become  
available again after the junction temperature drops. The thermal  
shutdown hysteresis is about 5 °C.  
where: T is junction temperature (°C);  
j
T is ambient temperature (°C);  
a
P is dissipated power (W);  
d
θ
is thermal resistance (°C/W).  
ja  
Thermal Resistance  
Thermal resistance is the ability of a packaged IC to dissipate heat  
to its environment. In semiconductor applications, it is highly  
dependant on the IC package, PCBs, and airflow. Thermal  
resistance also varies slightly with input power, the difference  
between ambient and junction temperatures, and soldering material.  
In order to avoid this transmit function shutdown, care must be taken  
to not overheat the IC during application. The relationships between  
junction temperature, ambient temperature, dissipated power, and  
thermal resistance can be expressed as:  
Figures 5 and 6 show the thermal resistance as the function of the  
IC package and the PCB configuration, assuming no airflow.  
200  
150  
100  
50  
very low  
conductance  
board  
low  
conductance  
board  
high  
conductance  
board  
0
0
50  
100  
150  
200  
250  
SL01249  
Cu area on fused pins (mm2)  
Figure 5.  
SO-8 Thermal Resistance vs. PCB Configuration, Note 1, 2, 3  
150  
100  
50  
very low  
conductance  
board  
low  
conductance  
board  
high  
conductance  
board  
0
0
100  
200  
300  
400  
500  
SL01250  
Cu area on fused pins (mm2)  
Figure 6.  
SO-14 Thermal Resistance vs. PCB Configuration, Note 1, 2, 3  
14  
2001 May 18  

AU5790D14/N,112 替代型号

型号 品牌 替代类型 描述 数据表
AU5790D14,518 NXP

完全替代

IC DATACOM, INTERFACE CIRCUIT, PDSO14, PLASTIC, SO-14, Network Interface
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IC DATACOM, INTERFACE CIRCUIT, PDSO14, PLASTIC, SO-14, Network Interface

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