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ATA2525S136C-DDW PDF预览

ATA2525S136C-DDW

更新时间： 2024-02-26 19:54:24
品牌 Logo 应用领域
美国微芯 - MICROCHIP 电信电信集成电路
页数 文件大小 规格书
12页 550K
描述
Telecom Circuit, 1-Func, DIE-11

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ATA2525S136C-DDW 技术参数

生命周期：Active包装说明：DIE,
Reach Compliance Code：compliantHTS代码：8542.39.00.01
风险等级：5.21JESD-30 代码：R-XUUC-N11
功能数量：1端子数量：11
最高工作温度：85 °C最低工作温度：-25 °C
封装主体材料：UNSPECIFIED封装代码：DIE
封装形状：RECTANGULAR封装形式：UNCASED CHIP
认证状态：Not Qualified标称供电电压：5 V
表面贴装：YES电信集成电路类型：TELECOM CIRCUIT
温度等级：OTHER端子形式：NO LEAD
端子位置：UPPERBase Number Matches：1

ATA2525S136C-DDW 数据手册

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Atmel Corporation  
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