Datasheet > ASM3I1819NF.08.SR

ASM3I1819NF.08.SR

更新时间： 2022-02-26 10:06:22

品牌	Logo	应用领域
安森美 - ONSEMI		/
页数	文件大小	规格书
6页	109K
描述
Low Power Mobile VGA EMI Reduction IC

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ASM3I1819NF.08.SR 数据手册

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ASM3P1819N

PD#

VDD

PLL

Modulation

XIN

Frequency

Divider

Crystal

Oscillator

XOUT

Output

Divider

Phase

Detector

Loop

Filter

VCO

Feedback

Divider

REF

ModOUT

VSS

Figure 1. Block Diagram

Table 1. PIN DESCRIPTION

Pin#

Pin Name

XIN

Type

Description

Connect to externally generated Clock signal or Crystal.

Ground Connection. Connect to system ground.

No Connect.

VSS

−

ModOUT

REF

Spread spectrum clock output.

Non−modulated Reference clock output of the input frequency.

PD#

Power down control pin. Pull LOW to enable Power−Down mode. This pin has an intern-

al pull−up resistor.

VDD

Connect to +3.3 V.

XOUT

Connect to crystal. No connect if externally generated clock signal is used.

Table 2. ABSOLUTE MAXIMUM RATINGS

Symbol

Parameter

Rating

−0.5 to +4.6

−65 to +125

−40 to +85

260

Unit

VDD, V

Voltage on any pin with respect to Ground

Storage temperature

STG

°C

Operating temperature

Max. Soldering Temperature (10 sec)

Junction Temperature

150

Static Discharge Voltage (As per JEDEC STD22− A114−B)

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

Table 3. OUTPUT FREQUENCY AND MODULATION RATE

Input Frequency Range (MHz)

Output Frequency Range (MHz)

Modulation Rate

Spread Deviation (%)

20 to 40

Input Frequency / 512

−1.25

http://onsemi.com

123 4 5 6

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