Datasheet > ASDL-4560

ASDL-4560

更新时间： 2022-04-23 23:00:11

品牌	Logo	应用领域
安华高科 - AVAGO		/
页数	文件大小	规格书
6页	159K
描述
High Performance Infrared Emitter (875nm) ChipLED

阅读下载

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

ASDL-4560 数据手册

Recommended Reﬂow Proﬁle

MAX 260C

255

230

217

200

180

60 sec to 90 sec

Above 217 C

150

120

100

150

200

250

300

HEAT

SOLDER

REFLOW

COOL DOWN

t-TIME

(SECONDS)

SOLDER PASTE DRY

Maximum DT/Dtime

Process Zone

Heat Up

Symbol

or Duration

P1, R1

P2, R2

25°C to 150°C

150°C to 200°C

ꢀ°C/s

Solder Paste Dry

Solder Reﬂow

100s to 180s

Pꢀ, Rꢀ

Pꢀ, R4

200°C to 260°C

260°C to 200°C

ꢀ°C/s

-6°C/s

Cool Down

P4, R5

200°C to 25°C

> 217°C

260°C

-6°C/s

60s to 90s

Time maintained above liquidus point , 217°C

Peak Temperature

Time within 5°C of actual Peak Temperature

Time 25°C to Peak Temperature

20s to 40s

8mins

25°C to 260°C

Process zone P3 is the solder reﬂow zone. In zone P3,

the temperature is quickly raised above the liquidus

point of solder to 260°C (500°F) for optimum results. The

dwell time above the liquidus point of solder should be

between 60 and 90 seconds. This is to assure proper co-

alescing of the solder paste into liquid solder and the

formation of good solder connections. Beyond the rec-

ommended dwell time the intermetallic growth within

the solder connections becomes excessive, resulting in

the formation of weak and unreliable connections. The

temperature is then rapidly reduced to a point below

the solidus temperature of the solder to allow the solder

within the connections to freeze solid.

The reﬂow proﬁle is a straight-line representation of

a nominal temperature proﬁle for a convective reﬂow

solder process. The temperature proﬁle is divided into

four process zones, each with diﬀerent DT/Dtime tem-

perature change rates or duration. The DT/Dtime rates or

duration are detailed in the above table. The tempera-

tures are measured at the component to printed circuit

board connections.

In process zone P1, the PC board and component pins

are heated to a temperature of 150°C to activate the ﬂux

in the solder paste. The temperature ramp up rate, R1,

is limited to 3°C per second to allow for even heating of

both the PC board and component pins.

Process zone P4 is the cool down after solder freeze.

The cool down rate, R5, from the liquidus point of the

solder to 25°C (77°F) should not exceed 6°C per second

maximum. This limitation is necessary to allow the PC

board and component pins to change dimensions evenly,

putting minimal stresses on the component.

Process zone P2 should be of suﬃcient time duration

(100 to 180 seconds) to dry the solder paste. The temper-

ature is raised to a level just below the liquidus point of

the solder.

It is recommended to perform reﬂow soldering no more

than twice.

1 2 3 456

下载PDF

与ASDL-4560相关器件

型号	品牌	描述	获取价格	数据表
ASDL-4561	AVAGO	High Performance Infrared Emitter (870nm) ChipLED	获取价格
ASDL-4650-C22	AVAGO	High Performance Infrared Emitter (875nm) ChipLED	获取价格
ASDL-4651-C22	AVAGO	High Performance Infrared Emitter (870nm) ChipLED	获取价格
ASDL-4670	LITEON	Property of Lite-On Only	获取价格
ASDL-4670	AVAGO	High Performance T-1 (3mm) AlGaAs/GaAs Infrared (940nm) Lamp	获取价格
ASDL-4670-C22	AVAGO	High Performance T-1 (3mm) AlGaAs/GaAs Infrared (940nm) Lamp	获取价格