Datasheet > ASDL-4360

ASDL-4360

更新时间： 2022-04-23 23:00:11

品牌	Logo	应用领域
安华高科 - AVAGO		/
页数	文件大小	规格书
6页	167K
描述
High Power and High Speed Infrared Emitter (885nm) in PLCC-2 Package

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ASDL-4360 数据手册

Recommended Reﬂow Proﬁle

MAX 260C

255

230

217

200

180

60 sec to 90 sec

Above 217 C

150

120

100

150

200

SOLDER

REFLOW

250

COOL DOWN

300

t-TIME

(SECONDS)

HEAT

SOLDER PASTE DRY

Maximum DT/Dtime

Process Zone

Heat Up

Symbol

or Duration

P1, R1

P2, R2

25°C to 150°C

150°C to 200°C

3°C/s

Solder Paste Dry

Solder Reﬂow

100s to 180s

P3, R3

P3, R4

200°C to 260°C

260°C to 200°C

3°C/s

-6°C/s

Cool Down

P4, R5

200°C to 25°C

> 217°C

260°C

-6°C/s

60s to 90s

Time maintained above liquidus point , 217°C

Peak Temperature

Time within 5°C of actual Peak Temperature

Time 25°C to Peak Temperature

20s to 40s

8mins

25°C to 260°C

The reﬂow proﬁle is a straight-line representation of a nominal temperature proﬁle for a convective reﬂow solder

process. The temperature proﬁle is divided into four process zones, each with diﬀerent DT/Dtime temperature change

rates or duration. The DT/Dtime rates or duration are detailed in the above table. The temperatures are measured at

the component to printed circuit board connections.

In process zone P1, the PC board and component pins are heated to a temperature of 150°C to activate the ﬂux in the

solder paste. The temperature ramp up rate, R1, is limited to 3°C per second to allow for even heating of both the PC

board and component pins.

Process zone P2 should be of suﬃcient time duration (100 to 180 seconds) to dry the solder paste. The temperature is

raised to a level just below the liquidus point of the solder.

Process zone P3 is the solder reﬂow zone. In zone P3, the temperature is quickly raised above the liquidus point of

solder to 260°C (500°F) for optimum results. The dwell time above the liquidus point of solder should be between 60

and 90 seconds. This is to assure proper coalescing of the solder paste into liquid solder and the formation of good

solder connections. Beyond the recommended dwell time the intermetallic growth within the solder connections

becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly

reduced to a point below the solidus temperature of the solder to allow the solder within the connections to freeze

solid.

Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder

to 25°C (77°F) should not exceed 6°C per second maximum. This limitation is necessary to allow the PC board and

component pins to change dimensions evenly, putting minimal stresses on the component.

It is recommended to perform reﬂow soldering no more than twice.

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