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AS4LC1M16EC-6 PDF预览

AS4LC1M16EC-6

更新时间: 2024-02-25 16:28:06
品牌 Logo 应用领域
MICROSS 动态存储器
页数 文件大小 规格书
22页 195K
描述
DRAM

AS4LC1M16EC-6 技术参数

生命周期:Active包装说明:,
Reach Compliance Code:compliant风险等级:5.75
Base Number Matches:1

AS4LC1M16EC-6 数据手册

 浏览型号AS4LC1M16EC-6的Datasheet PDF文件第2页浏览型号AS4LC1M16EC-6的Datasheet PDF文件第3页浏览型号AS4LC1M16EC-6的Datasheet PDF文件第4页浏览型号AS4LC1M16EC-6的Datasheet PDF文件第5页浏览型号AS4LC1M16EC-6的Datasheet PDF文件第6页浏览型号AS4LC1M16EC-6的Datasheet PDF文件第7页 
AS4LC1M16 883C  
1 MEG x 16 DRAM  
AUSTIN SEMICONDUCTOR, INC.  
DRAM  
1 MEG x 16PDRERLIMIANARMY  
3.3V, EDO PAGE MODE,  
OPTIONAL EXTENDED REFRESH  
AVAILABLE AS MILITARY  
SPECIFICATIONS  
PIN ASSIGNMENT (Top View)  
MIL-STD 883  
44/50-Pin SOJ/LCC/Gull Wing  
SMD Planned  
450mil  
FEATURES  
JEDEC- and industry-standard x16 timing, functions,  
pinouts and packages  
High-performance CMOS silicon-gate process  
Single +3.3V ±0.3V power supply  
All device pins are TTL-compatible  
Refresh modes: RAS ONLY, CAS-BEFORE-RAS (CBR),  
HIDDEN  
Vcc  
DQ1  
DQ2  
DQ3  
DQ4  
Vcc  
DQ5  
DQ6  
DQ7  
DQ8  
NC  
1
2
3
4
5
6
7
8
50  
49  
48  
47  
46  
45  
44  
43  
42  
41  
40  
Vss  
DQ16  
DQ15  
DQ14  
DQ13  
Vss  
DQ12  
DQ11  
DQ10  
DQ9  
9
10  
11  
BYTE WRITE access cycles  
NC  
1,024-cycle refresh (10 row-, 10 column-addresses)  
Low power, 0.3mW standby; 180mW active, typical  
Extended Data-Out (EDO) PAGE access cycle  
5V-tolerant I/ Os (5.5V maximum VIH level)  
NC  
NC  
WE  
RAS  
NC  
NC  
A0  
A1  
A2  
A3  
Vcc  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
NC  
CASL  
CASH  
OE  
A9  
A8  
A7  
A6  
A5  
OPTIONS  
MARKING  
Timing  
60ns access (Contact Factory)  
70ns access  
80ns access  
-6  
-7  
-8  
A4  
Vss  
Refresh Rate  
Standard 16ms period  
None  
Packages  
Ceramic SOJ  
Ceramic Gull Wing  
Ceramic LCC  
ECJ No. 506  
ECG No. 604  
EC No. 213  
an internal CAS.  
The AS4LC1M16 CAS function and timing are deter-  
mined by the first CAS (CASL or CASH) to transition LOW  
and the last CAS to transition back HIGH. Use of only one  
ofthetworesultsin a BYTEWRITEcycle.CASLtransitioning  
LOW selects an access cycle for the lower byte (DQ1-DQ8)  
and CASH transitioning LOW selects an access cycle for the  
upper byte (DQ9-DQ16).  
KEY TIMING PARAMETERS  
SPEED  
-6  
tRC  
tRAC  
60ns  
70ns  
80ns  
tPC  
tAA  
30ns  
35ns  
40ns  
tCAC  
15ns  
20ns  
20ns  
tCAS  
12ns  
12ns  
20ns  
105ns  
125ns  
150ns  
25ns  
30ns  
40ns  
-7  
-8  
GENERAL DESCRIPTION  
Each bit is uniquely addressed through the 20address bits  
during READ or WRITE cycles. These are entered 10 bits  
(A0-A9) at a time. RAS is used to latch the first 10 bits and  
CAS the latter 10 bits. The CAS function also determines  
whether the cycle will be a refresh cycle (RAS ONLY) or an  
active cycle (READ, WRITE or READ WRITE) once RAS  
goes LOW.  
The AS4LC1M16 is a randomly accessed solid-state  
memory containing 16,777,216 bits organized in a x16 con-  
figuration. The AS4LC1M16 has both BYTE WRITE and  
WORD WRITE access cycles via two CAS pins (CASL and  
CASH). These function in a similar manner to a single CAS  
of other DRAMs in that either CASL or CASH will generate  
AS4LC1M16  
REV. 3/97  
DS000020  
Austin Semiconductor, Inc., reserves the right to change products or specifications without notice.  
2-93  

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