Datasheet > AS08J1001ET

AS08J1001ET

更新时间： 2024-01-31 07:10:24

品牌	Logo	应用领域
OHMITE		/
页数	文件大小	规格书
2页	639K
描述
Anti-surge Thick Film Chip Resistors

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中文翻译

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AS08J1001ET 数据手册

AS Series

Anti-surge Thick Film Chip Resistors

F ꢀ At u ꢁ ꢀ S

•ꢀSmallꢀsizeꢀandꢀlightꢀweight

•ꢀSuitableꢀforꢀbothꢀwaveꢀandꢀreflowꢀsoldering

•ꢀCanꢀwithstandꢀhighꢀsurge

•ꢀReductionꢀofꢀassemblyꢀcosts

SꢀꢁꢂꢀS SpꢀcꢂFꢂcAtꢂonS

Power

Rating

at 70°C

0.33W

0.5W

Max

Working

Voltage

150V

200V

500V

Max

Overload

Voltage

300V

400V

500V

Dielectric

Withstanding

Voltage

500V

Resistance

Range

1Ω~10MΩ

1Ω~20MΩ

Type

AS08 (0805)

AS12 (1206)

AS25 (2512)

500V

1.5W

chAꢁActꢀꢁꢂStꢂcS

-55°C ~ +155°C

Std. Oper. Temp.

Standard Values

Construction

Test

ΔR

Test Methods (JIS C 5201-1 )

E-24 values

Thick film

1Ω-10Ω: ≤ ±400PPM/°C

(±200 PPM can be provid- R2-R1

ed on a case to case basis)

11Ω-10MΩ: ≤ ±100PPM/°C

Natural ΔR/°C

Temperature

Coefficient

x 10⁶(PPM/°C)

R1(t2-t1)

Silver, copper, nickel,

and tin, non-SAC alloy

Terminal material

R1: at room temp. (T1)

R2: at room temp. plus 100°C (T2)

Test pattern: room temp. (T1), room

temp. +100°C(T2)

Matte tin

Solderable finish

Tolerance

±5% standard; ±10%

and ±20% available

±(1.0% + 0.1Ω) max.

±(1.0% + 0.05Ω) max.

Permanent ΔR after the application of a

potential of 2.5 times RCWV for 5 sec.

Short Time

Overload

Derating

Twist of Test Board: Y/X = 3/90 mm for

60 sec.

Terminal

Bending

100

±(1.0% + 0.05Ω) max.

±(1.0% + 0.1Ω) max.

±(3.0% + 0.1Ω) max.

260°C±3°C for 10 ±1 sec.

See graph on next page.

Soldering Heat

Single Pulse

Humidity

Temporary ΔR after 240 hr. at 40 ±2°C

and 90-95% relative humidity

±(3.0% + 0.1Ω) max.

ΔR after 1,000 hr. (1.5 hr. "on", 0.5 hr.

"off" ) at RCWV at 40 ±2°C and 90-95%

relative humidity

Load Life in

Humidity

-55

50 70 100

155

Ambient Temperature, °C

ΔR change after 1,000 hr. operat-

ing at RCWV, with duty cycle of (1.5

hours"on", 0.5 hour"off") at 70°C ±2°C

ambient

Load Life

Reflow

300

250

200

150

100

Min. 95% coverage

Wave Solder: 245°C ±3°C for 2-3 sec.

Solderability

Soldering^{230° ~ 245°/250°}

20 ±10sec.

±(1.0% + 0.05Ω) max.

ΔR after 5 cycles:

-55°C ±3°C 30 min.

Room temp. 10-15 min.

+155°C ±2°C 30 min.

4 Room temp. 10-15 min.

Temperature

Cycling

Preheating

150° ~ 180°

90 ±30sec.

Cooling

No evidence of flashover,

mechanical damage, arcing lic v-block at specified AC potential

or insulation breakdown 60-70 sec.

Clamped in the trough of a 90°C metal-

Dielectric

withstanding

voltage

Time

1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax 1-847-574-7522 • www.ohmite.com • info@ohmite.com

中文翻译

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