RE (ARE)
• 75Ω type
CAD Data
Schematic (Top view)
20.2
.795
(0.7)
(.028)
NC
COM
NO
14 13 12 11 10
9 8
0.5
.020
11.2
.441
13.2
.520
1
7
Direction indication
(1.3)
(.511)
(Deenergized condition)
0.3
0.3
8.6
9.6
.378
.012
.012
.339
0.3
.012
(1.49)
(.059)
(2.09)
(.082)
2.54
.100
0.5
.020
7.62
.300
General tolerance: 0.3 .012
Note: Please consult us regarding recommended PC board patterns.
NOTES
1. Coil operating power
(2) IR (infrared reflow) soldering method
(1) Temperature:
Pure DC current should be applied to the
coil. The wave form should be
rectangular. If it includes ripple, the ripple
factor should be less than 5%.
However, check it with the actual circuit
since the characteristics may be slightly
different.
–40 to +70°C –40 to +158°F
(2) Humidity: 5 to 85% RH
(Avoid freezing and condensation.)
The humidity range varies with the
temperature. Use within the range
indicated in the graph below.
(3) Atmospheric pressure: 86 to 106 kPa
Temperature and humidity range for
usage, transport, and storage:
T3
T1=155 to 165°C
311 to 329°F
T2
T2=180 to 200°C
356 to 392°F
T3=245°C max.
473°F max.
t1=within 120s
t2=within 30s
T1
t1
t2
Temperature rise of relay itself may vary
according to the mounting level or the
heating method of reflow equipment.
Therefore, please set the temperature of
soldering portion of relay terminal and
the top surface of the relay case not to
exceed the above mentioned soldering
condition.
It is recommended to check the
temperature rise of each portion under
actual mounting condition before use.
4. Packing style
2. Cleaning
For automatic cleaning, the boiling
method is recommended. Avoid
ultrasonic cleaning which subjects the
relays to high frequency vibrations, which
may cause the contacts to stick.
It is recommended that alcoholic solvents
be used.
Humidity, %R.H.
85
Tolerance range
(Avoid freezing (Avoid
when used at
temperatures
lower than
0°C 32°F)
condensation
when used at
temperatures
higher than
0°C 32°F)
3. Soldering
(Standard PC board terminal)
1) The manual soldering shall be
performed under following condition.
Max. 260°C 500°F 10s
5
–40
–40
0
70
+158
+32
Temperature, °C °F
1) Tape dimensions
1.5+−00.1 .059+−0.004 dia.
Max. 350°C 662°F 3s
2) Condensation
4
1.75
.069
2.0 0.15
0.4
.157
The affect of the PCB on the relay will
differ depending on the type of PCB
used. Please verify the type of PCB to be
used.
Preheat according to the following
conditions.
Relay polarity bar
.079 .006
.016
Condensation forms when there is a
sudden change in temperature under
high temperature and high humidity
conditions. Condensation will cause
deterioration of the relay insulation.
3) Freezing
Condensation or other moisture may
freeze on the relay when the temperature
is lower than 0°C 32°F. This causes
problems such as sticking of movable
parts or operational time lags.
4) Low temperature, low humidity
environments
44 0.3
20.2
.795
1.732 .012
20.75
.817
1.7
40.4
1.591
.067
R0.75
.030
1.5 .059
RE Relay
20.0
.787
13.85
.545
10.6−+00..32
.417−+..000128
Tape coming out direction
Temperature
120°C 248°F or less
2) Dimensions of plastic reel
Time
Within 2 minute
Soldering should be done at 260 5°C
500 9°F within 6 s.
2) In case of automatic soldering, the
following conditions should be observed
(Surface-mount terminal)
21 0.8 dia.
.827 .031 dia.
Max. 95
3.740
380 0.2
14.961 .008
13 0.2 dia.
.512 .008 dia.
2.0 0.5
(1) Position of measuring temperature
The plastic becomes brittle if the relay is
exposed to a low temperature, low
humidity environment for long periods of
time.
.079 .020
45.5−+00.2
1.791−+.0008
Max. 51.7
2.035
A
5. Conditions for operation, transport
and storage conditions
1) Ambient temperature, humidity, and
atmospheric pressure during usage,
transport, and storage of the relay:
A: Surface of PC board where relay is mounted.
For general cautions for use, please
refer to the “General Application
Guidelines”.
ASCTB104E 201202-T
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/
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