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AN7177NK PDF预览

AN7177NK

更新时间: 2024-01-13 09:20:03
品牌 Logo 应用领域
松下 - PANASONIC 局域网放大器商用集成电路
页数 文件大小 规格书
3页 216K
描述
Audio Amplifier, ZIP-23

AN7177NK 技术参数

生命周期:Obsolete零件包装代码:ZIP
包装说明:,针数:23
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.33.00.01风险等级:5.84
商用集成电路类型:AUDIO AMPLIFIERJESD-30 代码:R-XZFM-T23
端子数量:23封装主体材料:UNSPECIFIED
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
认证状态:Not Qualified表面贴装:NO
端子形式:THROUGH-HOLE端子位置:ZIG-ZAG
Base Number Matches:1

AN7177NK 数据手册

 浏览型号AN7177NK的Datasheet PDF文件第1页浏览型号AN7177NK的Datasheet PDF文件第2页 
Request for your special attention and precautions in using the technical information and  
semiconductors described in this book  
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and  
regulations of the exporting country, especially, those with regard to security export control, must be observed.  
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples  
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any  
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any  
other company which may arise as a result of the use of technical information described in this book.  
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office  
equipment, communications equipment, measuring instruments and household appliances).  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support  
systems and safety devices) in which exceptional quality and reliability requied, or if the failure or malfunction of the prod-  
ucts may directly jeopardize life or harm the human body.  
Any applications other than the standard applications intended.  
(4) The products and product specifications described in this book are subjet to change wit notice for modification and/or im-  
provement. At the final stage of your design, purchasingr use of the roducts, therfor the most up-to-date Product  
Standards in advance to make sure that the latest specifictions stisfy your requirements.  
(5) When designing your equipment, comply with he ange f absolute maximing nd the guaranteed operating conditions  
(operating power supply voltage and operating nvirent etc.). Especiall, plee be ceful not to exceed the range of absolute  
maximum rating on the transient state, such as powpower-off and modeswitching. Otherwise, we will not be liable for any  
defect which may arise later in your equpmen
Even when the products are used withthe guaanteed values, kinto he cosideration of incidence of break down and failure  
mode, possible to occur to semiconductor products. Measures on the sytems such as redundant design, arresting the spread of fire  
or preventing glitch are recommin ordto prevent physicinjury, fre, social damaes, for example, by using the products.  
(6) Comply with the instructios for se in rder to prevent breakdwn and characteristics change due to external factors (ESD, EOS,  
thermal stress and mechanicastress) at the time of andlig, mounting or at customer's process. When using products for which  
damp-proof packinis reqired, stisfy the condtions, sch as shelf life and the elapsed time since first opening the packages.  
(7) This book may e not eprinted or reprodhethr wholly or partially, without the prior written permission of our company.  
2008080

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