AMIS−41682, AMIS−41683
Table 2. PIN DESCRIPTION
Pin
1
Name
INH
Description
Inhibit Output for External Voltage Regulator
2
TxD
Transmit Data Input; Internal Pullup Current
Receive Data Output
3
RxD
ERR
STB
EN
4
Error; Wake−up and Power−on Flag; Active Low
Standby Digital Control Input; Active Low; Pulldown Resistor
Standby Digital Control Input; Active High; Pulldown Resistor
Enable Digital Control Input; Falling and Rising Edges are Both Detected
Pin for External Termination Resistor at CANH
Pin for External Termination Resistor at CANL
5 V Supply Input
5
6
7
WAKE
RTH
RTL
8
9
10
11
12
13
14
V
CC
CANH
CANL
GND
Bus Line; High in Dominant State
Bus Line; Low in Dominant State
Ground
V
BAT
Battery Supply
Table 3. ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Min
−0.3
−0.3
−0.3
−40
−350
−40
−0.3
−40
500
500
−40
−6
Max
+6
Unit
V
V
V
V
V
V
V
V
V
Supply Voltage on Pin V
CC
CC
Battery Voltage on Pin V
+40
V
BAT
BAT
DC Voltage on Pins EN, STB, ERR, TxD, RxD
DC Voltage on Pin CANH, CANL
V
+ 0.3
V
dig
CC
+40
+350
+40
V
CANH−L
tran−CAN
WAKE
INH
Transient Voltage on Pins CANH and CANL (Figure 10) (Note 1)
DC Input Voltage on Pin WAKE
V
V
DC Output Voltage on Pin INH
V
+ 0.3
V
BAT
DC Voltage on Pin RTH, RTL
40
V
RTH−L
R
R
Termination Resistance on Pin RTH
Termination Resistance on Pin RTL
Maximum Junction Temperature
16000
16000
+150
+6
W
W
°C
kV
RTH
RTL
T
J
V
esd
Electrostatic discharge voltage (CANH− and CANL Pin)
Human Body Model (Note 2)
Electrostatic Discharge Voltage (Other Pins) Human Body Model (Note 2)
Electrostatic Discharge Voltage; CDM (Note 3)
−2.0
+2.0
kV
V
−500
+500
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. The applied transients shall be in accordance with ISO 7637 part 1, test pulses 1, 2, 3a, and 3b. Class C operation
2. Human Body Model according Mil−Std−883C−Meth−3015.7
3. Charged Device Model according ESD−STM5.3.1−1999
Table 4. THERMAL CHARACTERISTICS
Symbol
Parameter
Conditions
Value
Unit
R
Thermal Resistance from Junction−to−Ambient in SSOP−14 Package
(Two Layer PCB)
In Free Air
140
K/W
th(vj−a)
R
Thermal Resistance from Junction−to−Substrate of Bare Die
In Free Air
30
K/W
th(vj−s)
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