AMIS-30624-PNA-XTD

更新时间： 2024-02-20 03:00:34

阅读下载

获取价格

如果您发现信息不准确，欢迎纠错

AMIS-30624-PNA-XTD 技术参数

AMIS-30624 I²C Microstepping Motordriver

Data Sheet

9.0 Package Thermal Resistance

9.1 SOIC-20

To lower the junction-to-ambient thermal resistance, it is recommended to connect the ground leads to a printed circuit board (PCB)

ground plane layout as illustrated in Figure 3. The junction-to-case thermal resistance is dependent on the copper area, copper

thickness, PCB thickness and number of copper layers. Calculating with a total area of 460 mm², 35µm copper thickness, 1.6mm PCB

thickness and 1 layer, the thermal resistance is 28°C/W; leading to a junction-ambient thermal resistance of 63°C/W.

PC20041128.1

Figure 3: PCB Ground Plane Layout Condition

9.2 NQFP-32

The NQFP is designed to provide superior thermal performance, and using an exposed die pad on the bottom surface of the package

partly contributes to this. In order to take full advantage of this thermal performance, the PCB must have features to conduct heat away

from the package. A thermal grounded pad with thermal vias can achieve this. With a layout as shown in Figure 4, the thermal

resistance junction – to – ambient can be brought down to a level of 25°C/W.

NQFP-32

PC20041128.2

Figure 4: PCB Ground Plane Layout Condition

AMI Semiconductor – Apr. 2007, Rev 3.1, M-20664-003

www.amis.com

1...4 5 678 9 10...56

下载PDF

型号	品牌	描述	获取价格	数据表
AMIS-30624-PNA-XTP	ONSEMI	IC,MOTOR CONTROLLER,LLCC,32PIN	获取价格
AMIS-3062X	AMI	Bus Microstepping Motordriver Family	获取价格
AMIS-30660	AMI	High Speed CAN Transceiver	获取价格
AMIS-30660	ONSEMI	High Speed CAN Transceiver	获取价格
AMIS30660CANH2G	ONSEMI	High Speed CAN Transceiver	获取价格
AMIS30660CANH2RG	ONSEMI	High Speed CAN Transceiver	获取价格