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AMIS-30623AANA PDF预览

AMIS-30623AANA

更新时间： 2024-02-25 11:29:23
品牌 Logo 应用领域
AMI 电动机控制
页数 文件大小 规格书
67页 3352K
描述
LIN Microstepping Motordriver

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AMIS-30623AANA 技术参数

生命周期：Transferred包装说明：7 X 7 MM, NQFP-32
Reach Compliance Code：unknown风险等级：5.61
模拟集成电路 - 其他类型：STEPPER MOTOR CONTROLLERJESD-30 代码：S-XQCC-N32
功能数量：1端子数量：32
最高工作温度：125 °C最低工作温度：-40 °C
最大输出电流：0.8 A封装主体材料：UNSPECIFIED
封装代码：QCCN封装形状：SQUARE
封装形式：CHIP CARRIER认证状态：Not Qualified
最大供电电压 (Vsup)：29 V最小供电电压 (Vsup)：8 V
表面贴装：YES温度等级：AUTOMOTIVE
端子形式：NO LEAD端子位置：QUAD
Base Number Matches：1

AMIS-30623AANA 数据手册

 浏览型号AMIS-30623AANA的Datasheet PDF文件第61页浏览型号AMIS-30623AANA的Datasheet PDF文件第62页浏览型号AMIS-30623AANA的Datasheet PDF文件第63页浏览型号AMIS-30623AANA的Datasheet PDF文件第64页浏览型号AMIS-30623AANA的Datasheet PDF文件第65页浏览型号AMIS-30623AANA的Datasheet PDF文件第66页 
AMIS-30623 LIN Microstepping Motordriver  
Data Sheet  
Notes:  
(1) All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the  
package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to  
the drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods.”  
(2) These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder  
may stick to the heatsink (on top version).  
(3) If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves  
downstream and at the side corners.  
(4) Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8mm; it is definitely not suitable for packages with a pitch (e)  
equal to or smaller than 0.65mm.  
(5) Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65mm; it is definitely not suitable for packages with a pitch (e)  
equal to or smaller than 0.5mm.  
21.0 Company or Product Inquiries  
For more information about AMI Semiconductor, our technology and our product, visit our Web site at: http://www.amis.com.  
North America  
Tel: +1.208.233.4690  
Fax : +1.208.234.6795  
Europe  
Tel : +32 (0) 55.33.22.11  
Fax : +32 (0) 55.31.81.12  
22.0 Document History  
Table 40: Document history  
Version  
1.0  
2.1  
Date of Version  
July 16, 2002  
Modifications/Additions  
First non-preliminary issue  
Complete review  
December 5th , 2005  
June 19, 2006  
3.0  
Public release  
Devices sold by AMIS are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. AMIS makes no warranty, express,  
statutory, implied or by description, regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. AMIS  
makes no warranty of merchantability or fitness for any purposes. AMIS reserves the right to discontinue production and change specifications and prices at any  
time and without notice. AMI Semiconductor's products are intended for use in commercial applications. Applications requiring extended temperature range,  
unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment, are specifically not  
recommended without additional processing by AMIS for such applications. Copyright ©2006 AMI Semiconductor, Inc.  
AMI Semiconductor – June 2006, Rev 3.0  
67  
www.amis.com  
 
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