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AM45DL32X8G PDF预览

AM45DL32X8G

更新时间: 2022-01-18 23:27:00
品牌 Logo 应用领域
其他 - ETC 闪存静态存储器
页数 文件大小 规格书
64页 1122K
描述
Am45DL32x8G - Stacked Multi-Chip Package (MCP) Flash Memory and SRAM

AM45DL32X8G 数据手册

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Am45DL32x8G  
Data Sheet  
July 2003  
The following document specifies Spansion memory products that are now offered by both Advanced  
Micro Devices and Fujitsu. Although the document is marked with the name of the company that orig-  
inally developed the specification, these products will be offered to customers of both AMD and  
Fujitsu.  
Continuity of Specifications  
There is no change to this datasheet as a result of offering the device as a Spansion product. Any  
changes that have been made are the result of normal datasheet improvement and are noted in the  
document revision summary, where supported. Future routine revisions will occur when appropriate,  
and changes will be noted in a revision summary.  
Continuity of Ordering Part Numbers  
AMD and Fujitsu continue to support existing part numbers beginning with “Am” and “MBM. To order  
these products, please use only the Ordering Part Numbers listed in this document.  
For More Information  
Please contact your local AMD or Fujitsu sales office for additional information about Spansion  
memory solutions.  
Publication Number 26502 Revision A Amendment +3 Issue Date August 28, 2002  

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