Datasheet > AFCT-5942ALZ

AFCT-5942ALZ

更新时间： 2022-05-14 22:18:10

品牌	Logo	应用领域
博通 - BOARDCOM		/
页数	文件大小	规格书
18页	574K
描述
Single Mode SFF Transceivers for SONET OC-48/SDH STM-16 Singlerate Operation

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AFCT-5942ALZ 数据手册

Package

The overall package concept for the device consists of

the following basic elements; two optical subassemblies,

a electrical subassembly and the housing as illustrated in

the block diagram in Figure3.

The receiver electrical subassembly includes an internal

shield for the electrical and optical subassembly to en-

sure high immunity to external EMI ﬁelds.

The optical subassemblies are attached to the electrical

subassembly. These two units are then ﬁtted within the

outer housing of the transceiver. The housing is then en-

cased with a metal EMI protective shield.

The package outline drawing and pin out are shown in

Figures 4 and 5. The details of this package outline and

pin out are compliant with the multisource deﬁnition of

the 2 x 10 DIP.

The electrical subassembly carries the signal pins that

exit from the bottom of the transceiver. The solder

posts are designed to provide the mechanical strength

required to withstand the loads imposed on the trans-

ceiver by mating with the LC connectored ﬁber cables.

Although they are not connected electrically to the

transceiver, it is recommended to connect them to chas-

sis ground.

In combination with the metalized nose segment of the

package a metallic nose clip provides connection to

chassis ground for both EMI and thermal dissipation.

The electrical subassembly consists of high volume mul-

tilayer printed circuit boards on which the IC and various

surface-mounted passive circuit elements are attached.

R_XSUPPLY

PHOTO DETECTOR

BIAS

DATA OUT

PIN PHOTODIODE

PREAMPLIFIER

SUBASSEMBLY

QUANTIZER IC

DATA OUT

R_XGROUND

SIGNAL

DETECT

T_XGROUND

RECEPTACLE

DATA IN

Tx DISABLE

B_MON(+)

B_MON(-)

LASER BIAS

MONITORING

LASER

OPTICAL

SUBASSEMBLY

LASER DRIVER

AND CONTROL

CIRCUIT

LASER DIODE

OUTPUT POWER

MONITORING

P_MON(+)

P_MON(-)

T_XSUPPLY

CASE

* NOSE CLIP PROVIDES CONNECTION TO CHASSIS GROUND FOR BOTH EMI AND THERMAL DISSIPATION.

Figure 3. Block Diagram

1 2 345 6 7...18

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