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ADT7422 PDF预览

ADT7422

更新时间: 2023-12-20 18:46:03
品牌 Logo 应用领域
亚德诺 - ADI 温度传感传感器温度传感器
页数 文件大小 规格书
23页 411K
描述
适用于 VSM 应用的精度为 ±0.1°C 的 16 位数字 I2C?温度传感器

ADT7422 数据手册

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Data Sheet  
ADT7422  
ABSOLUTE MAXIMUM RATINGS  
TA = 25°C, unless otherwise noted.  
THERMAL RESISTANCE  
Thermal performance is directly linked to PCB design and  
operating environment. Close attention to PCB thermal design  
is required. θJA and θJC are specified for a device soldered on a  
JEDEC 4-layer test board for surface-mount packages with  
16 thermal vias. The values listed in Table 4 are based on  
simulated data.  
Table 3.  
Parameter  
Rating  
VDD to GND  
SDA Voltage to GND  
−0.3 V to +7 V  
−0.3 V to VDD + 0.3 V  
−0.3 V to VDD + 0.3 V  
−0.3 V to VDD + 0.3 V  
−0.3 V to VDD + 0.3 V  
−0.3 V to VDD + 0.3 V  
−40°C to +125°C  
−65°C to +150°C  
150°C  
SCL Output Voltage to GND  
A0 Input Voltage to GND  
A1 Input Voltage to GND  
CT and INT Output Voltage to GND  
Operating Temperature Range  
Storage Temperature Range  
Maximum Junction Temperature  
ESD  
Table 4. Thermal Resistance  
Package Type  
θJA  
θJC  
Unit  
CP-16-17  
37  
33  
°C/W  
ESD CAUTION  
Human Body Model (HBM)  
Field Induced Charge Device Model  
(FICDM)  
2 kV  
1 kV  
Reflow Soldering (Pb-Free)  
Peak Temperature  
JEDEC J-STD-020  
260°C  
Time at Peak Temperature  
10 sec to 40 sec  
Stresses at or above those listed under Absolute Maximum  
Ratings may cause permanent damage to the product. This is a  
stress rating only; functional operation of the product at these  
or any other conditions above those indicated in the operational  
section of this specification is not implied. Operation beyond  
the maximum operating conditions for extended periods may  
affect product reliability.  
Rev. A | Page 5 of 23  
 
 
 
 

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