Data Sheet
ADT7422
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
THERMAL RESISTANCE
Thermal performance is directly linked to PCB design and
operating environment. Close attention to PCB thermal design
is required. θJA and θJC are specified for a device soldered on a
JEDEC 4-layer test board for surface-mount packages with
16 thermal vias. The values listed in Table 4 are based on
simulated data.
Table 3.
Parameter
Rating
VDD to GND
SDA Voltage to GND
−0.3 V to +7 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−40°C to +125°C
−65°C to +150°C
150°C
SCL Output Voltage to GND
A0 Input Voltage to GND
A1 Input Voltage to GND
CT and INT Output Voltage to GND
Operating Temperature Range
Storage Temperature Range
Maximum Junction Temperature
ESD
Table 4. Thermal Resistance
Package Type
θJA
θJC
Unit
CP-16-17
37
33
°C/W
ESD CAUTION
Human Body Model (HBM)
Field Induced Charge Device Model
(FICDM)
2 kV
1 kV
Reflow Soldering (Pb-Free)
Peak Temperature
JEDEC J-STD-020
260°C
Time at Peak Temperature
10 sec to 40 sec
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Rev. A | Page 5 of 23