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ADT6502SRJZP115RL7 PDF预览

ADT6502SRJZP115RL7

更新时间： 2024-01-22 12:46:48
品牌 Logo 应用领域
亚德诺 - ADI 开关传感器换能器输出元件
页数 文件大小 规格书
16页 295K
描述
Low Cost, 2.7 V to 5.5 V, Micropower Temperature Switches in SOT-23

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ADT6502SRJZP115RL7 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active包装说明：ROHS COMPLIANT, SOT-23, 5 PIN
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01风险等级：5.81
Is Samacsys：N最大精度（摄氏度）：6 Cel
主体宽度：1.6 mm主体高度：1.45 mm
主体长度或直径：2.9 mmJESD-609代码：e3
安装特点：SURFACE MOUNT位数：11
端子数量：5最大工作电流：0.05 mA
最高工作温度：125 °C最低工作温度：-55 °C
输出接口类型：I2C INTERFACE封装主体材料：PLASTIC/EPOXY
封装等效代码：TSOP5/6,.11,37封装形状/形式：RECTANGULAR
电源：3/5 V传感器/换能器类型：TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SINGLE TRIP POINT
子类别：Other Sensors/Transducers最大供电电压：5.5 V
最小供电电压：2.7 V表面贴装：YES
端子面层：Matte Tin (Sn)端接类型：SOLDER
Base Number Matches：1

ADT6502SRJZP115RL7 数据手册

 浏览型号ADT6502SRJZP115RL7的Datasheet PDF文件第1页浏览型号ADT6502SRJZP115RL7的Datasheet PDF文件第2页浏览型号ADT6502SRJZP115RL7的Datasheet PDF文件第3页浏览型号ADT6502SRJZP115RL7的Datasheet PDF文件第5页浏览型号ADT6502SRJZP115RL7的Datasheet PDF文件第6页浏览型号ADT6502SRJZP115RL7的Datasheet PDF文件第7页 
ADT6501/ADT6502/ADT6503/ADT6504  
Data Sheet  
ABSOLUTE MAXIMUM RATINGS  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
Table 2.  
Parameter  
Rating  
VCC to GND  
−0.3 V to +7 V  
−0.3 V to VCC + 0.3 V  
−0.3 V to +7 V  
−0.3 V to VCC + 0.3 V  
20 mA  
HYST Input Voltage to GND  
Open-Drain Output Voltage to GND  
Push-Pull Output Voltage to GND  
Input Current on All Pins  
Output Current on All Pins  
Operating Temperature Range  
Storage Temperature Range  
Maximum Junction Temperature, TJMAX  
5-Lead SOT-23 (RJ-5)  
0.9  
20 mA  
−55°C to +125°C  
−65°C to +160°C  
150.7°C  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
Power Dissipation1  
Thermal Impedance3  
WMAX = (TJMAX − TA )/θJA  
2
θJA, Junction-to-Ambient (Still Air) 240°C/W  
IR Reflow Soldering  
(RoHS Compliant Package)  
Peak Temperature  
0.1  
260°C (+0°C)  
SOT-23 PD @ 125°C = 0.107W  
0
Time at Peak Temperature  
Ramp-Up Rate  
Ramp-Down Rate  
20 sec to 40 sec  
3°C/sec maximum  
−6°C/sec maximum  
8 minute maximum  
–55 –40 –20  
0
20  
40  
60  
80  
100 120  
–50 –30 –10  
10  
30  
50  
70  
90 110 125  
TEMPERATURE (°C)  
Figure 2. SOT-23 Maximum Power Dissipation vs. Temperature  
Time 25°C to Peak Temperature  
1 Values relate to package being used on a standard 2-layer PCB. This gives a  
worst case θJA. Refer to Figure 2 for a plot of maximum power dissipation vs.  
ambient temperature (TA).  
ESD CAUTION  
2 TA = ambient temperature.  
3 Junction-to-case resistance is applicable to components featuring a  
preferential flow direction, for example, components mounted on a  
heat sink. Junction-to-ambient resistance is more useful for air-cooled,  
PCB-mounted components.  
Rev. B | Page 4 of 16  
 
 
 
 
 
 
 
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