ADSP-BF522/ADSP-BF523/ADSP-BF524/ADSP-BF525/ADSP-BF526/ADSP-BF527
ORDERING GUIDE
Temperature
Range2
Instruction
Rate (Max) Package Description
Package
Option
Model1
ADSP-BF522BBCZ-3A
ADSP-BF522BBCZ-4A
ADSP-BF522KBCZ-3
ADSP-BF522KBCZ-4
ADSP-BF523BBCZ-5A
ADSP-BF523KBCZ-5
ADSP-BF523KBCZ-6
ADSP-BF523KBCZ-6A
ADSP-BF524BBCZ-3A
ADSP-BF524BBCZ-4A
ADSP-BF524KBCZ-3
ADSP-BF524KBCZ-4
ADSP-BF525ABCZ-5
ADSP-BF525ABCZ-6
ADSP-BF525BBCZ-5A
ADSP-BF525KBCZ-5
ADSP-BF525KBCZ-6
ADSP-BF525KBCZ-6A
ADSP-BF526BBCZ-3A
ADSP-BF526BBCZ-4A
ADSP-BF526KBCZ-3
ADSP-BF526KBCZ-4
ADSP-BF527BBCZ-5A
ADSP-BF527KBCZ-5
ADSP-BF527KBCZ-6
ADSP-BF527KBCZ-6A
1 Z = RoHS Compliant Part.
–40°C to +85°C
–40°C to +85°C
0°C to +70°C
0°C to +70°C
–40°C to +85°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
–40°C to +85°C
–40°C to +85°C
0°C to +70°C
0°C to +70°C
–40°C to +70°C
–40°C to +70°C
–40°C to +85°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
–40°C to +85°C
–40°C to +85°C
0°C to +70°C
0°C to +70°C
–40°C to +85°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
300 MHz
400 MHz
300 MHz
400 MHz
533 MHz
533 MHz
600 MHz
600 MHz
300 MHz
400 MHz
300 MHz
400 MHz
500 MHz
600 MHz
533 MHz
533 MHz
600 MHz
600 MHz
300 MHz
400 MHz
300 MHz
400 MHz
533 MHz
533 MHz
600 MHz
600 MHz
208-Ball Chip Scale Package Ball Grid Array (CSP_BGA)
BC-208-2
BC-208-2
BC-289-2
BC-289-2
BC-208-2
BC-289-2
BC-289-2
BC-208-2
BC-208-2
BC-208-2
BC-289-2
BC-289-2
BC-289-2
BC-289-2
BC-208-2
BC-289-2
BC-289-2
BC-208-2
BC-208-2
BC-208-2
BC-289-2
BC-289-2
BC-208-2
BC-289-2
BC-289-2
BC-208-2
208-Ball Chip Scale Package Ball Grid Array (CSP_BGA)
289-Ball Chip Scale Package Ball Grid Array (CSP_BGA)
289-Ball Chip Scale Package Ball Grid Array (CSP_BGA)
208-Ball Chip Scale Package Ball Grid Array (CSP_BGA)
289-Ball Chip Scale Package Ball Grid Array (CSP_BGA)
289-Ball Chip Scale Package Ball Grid Array (CSP_BGA)
208-Ball Chip Scale Package Ball Grid Array (CSP_BGA)
208-Ball Chip Scale Package Ball Grid Array (CSP_BGA)
208-Ball Chip Scale Package Ball Grid Array (CSP_BGA)
289-Ball Chip Scale Package Ball Grid Array (CSP_BGA)
289-Ball Chip Scale Package Ball Grid Array (CSP_BGA)
289-Ball Chip Scale Package Ball Grid Array (CSP_BGA)
289-Ball Chip Scale Package Ball Grid Array (CSP_BGA)
208-Ball Chip Scale Package Ball Grid Array (CSP_BGA)
289-Ball Chip Scale Package Ball Grid Array (CSP_BGA)
289-Ball Chip Scale Package Ball Grid Array (CSP_BGA)
208-Ball Chip Scale Package Ball Grid Array (CSP_BGA)
208-Ball Chip Scale Package Ball Grid Array (CSP_BGA)
208-Ball Chip Scale Package Ball Grid Array (CSP_BGA)
289-Ball Chip Scale Package Ball Grid Array (CSP_BGA)
289-Ball Chip Scale Package Ball Grid Array (CSP_BGA)
208-Ball Chip Scale Package Ball Grid Array (CSP_BGA)
289-Ball Chip Scale Package Ball Grid Array (CSP_BGA)
289-Ball Chip Scale Package Ball Grid Array (CSP_BGA)
208-Ball Chip Scale Package Ball Grid Array (CSP_BGA)
2 Referencedtemperatureisambienttemperature. Theambienttemperatureisnotaspecification.PleaseseeOperatingConditionsforADSP-BF522/ADSP-BF524/ADSP-BF526
Processors on Page 28 and Operating Conditions for ADSP-BF523/ADSP-BF525/ADSP-BF527 Processors on Page 30 for junction temperature (TJ) specification which is
the only temperature specification.
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registered trademarks are the property of their respective owners.
D06675-0-7/13(D)
Rev. D
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Page 88 of 88 | July 2013