ADP3309
THEORY OF OPERATION
Additional features of the circuit include current limit and ther-
mal shutdown. Compared to the standard solutions that give
warning after the output has lost regulation, the ADP3309
provides improved system performance by enabling the ERR
pin to give warning before the device loses regulation.
The ADP3309 anyCAP LDO uses a single control loop for
regulation and reference functions. The output voltage is sensed
by a resistive voltage divider consisting of R1 and R2, which is
varied to provide the available output voltage option. Feedback
is taken from this network by way of a series diode (D1) and a
second resistor divider (R3 and R4) to the input of an amplifier.
As the chip’s temperature rises above 165°C, the circuit acti-
vates a soft thermal shutdown, indicated by a signal low on the
ERR pin, to reduce the current to a safe level.
OUTPUT
INPUT
Q1
COMPENSATION
CAPACITOR
APPLICATION INFORMATION
Capacitor Selection: anyCAP
ATTENUATION
(V /V
R1
(a)
R2
)
BANDGAP OUT
D1
R3
Output Capacitors: As with any micropower device, output
transient response is a function of the output capacitance. The
ADP3309 is stable with a wide range of capacitor values, types
and ESR (anyCAP). A capacitor as low as 0.47 µF is all that is
needed for stability. However, larger capacitors can be used if
high output current surges are anticipated. The ADP3309 is
stable with extremely low ESR capacitors (ESR ≈ 0), such as
multilayer ceramic capacitors (MLCC) or OSCON.
PTAT
R
LOAD
NONINVERTING
WIDEBAND
DRIVER
V
OS
G
M
PTAT
CURRENT
R4
C
LOAD
ADP3309
GND
Figure 20. Functional Block Diagram
Input Bypass Capacitor: An input bypass capacitor is not re-
quired. However, for applications where the input source is high
impedance or far from the input pin, a bypass capacitor is rec-
ommended. Connecting a 0.47 µF capacitor from the input pin
(Pin 1) to ground reduces the circuit’s sensitivity to PC board
layout. If a bigger output capacitor is used, the input capacitor
must be 1 µF minimum.
A very high gain error amplifier is used to control this loop. The
amplifier is constructed in such a way that at equilibrium it
produces a large, temperature proportional input “offset volt-
age” that is repeatable and very well controlled. The tem-
perature proportional offset voltage is combined with the
complementary diode voltage to form a “virtual bandgap” volt-
age, implicit in the network, although it never appears explicitly
in the circuit. Ultimately, this patented design makes it possible
to control the loop with only one amplifier. This technique also
improves the noise characteristics of the amplifier by providing
more flexibility on the trade-off of noise sources that leads to a
low noise design.
Thermal Overload Protection
The ADP3309 is protected against damage due to excessive
power dissipation by its thermal overload protection circuit,
which limits the die temperature to a maximum of 165°C.
Under extreme conditions (i.e., high ambient temperature and
power dissipation) where die temperature starts to rise above
165°C, the output current is reduced until the die temperature
has dropped to a safe level. The output current is restored when
the die temperature is reduced.
The R1, R2 divider is chosen in the same ratio as the bandgap
voltage to the output voltage. Although the R1, R2 resistor
divider is loaded by the diode D1, and a second divider consist-
ing of R3 and R4, the values can be chosen to produce a tem-
perature stable output.
Current and thermal limit protections are intended to protect
the device against accidental overload conditions. For normal
operation, device power dissipation should be externally limited
so that junction temperatures will not exceed 125°C.
The patented amplifier controls a new and unique noninverting
driver that drives the pass transistor, Q1. The use of this special
noninverting driver enables the frequency compensation to
include the load capacitor in a pole splitting arrangement to
achieve reduced sensitivity to the value, type and ESR of the
load capacitance.
Calculating Junction Temperature
Device power dissipation is calculated as follows:
PD = (VIN – VOUT) ILOAD + (VIN) IGND
Most LDOs place very strict requirements on the range of ESR
values for the output capacitor because they are difficult to
stabilize due to the uncertainty of load capacitance and resis-
tance. Moreover, the ESR value, required to keep conventional
LDOs stable, changes depending on load and temperature.
These ESR limitations make designing with LDOs more diffi-
cult because of their unclear specifications and extreme varia-
tions over temperature.
Where ILOAD and IGND are load current and ground current, VIN
and VOUT are input and output voltages respectively.
Assuming ILOAD = 100 mA, IGND = 2 mA, VIN = 5.0 V and
VOUT = 3.3 V, device power dissipation is:
PD = (5.0 – 3.3) 100 mA + 5.0 × 2 mA = 180 mW
∆T = TJ – TA = PD × θJA = 0.18 × 190 = 34.2°C
With a maximum junction temperature of 125°C, this yields a
maximum ambient temperature of ~90°C.
This is no longer true with the ADP3309 anyCAP LDO. It can
be used with virtually any capacitor, with no constraint on the
minimum ESR. This innovative design allows the circuit to be
stable with just a small 0.47 µF capacitor on the output. Addi-
tional advantages of the design scheme include superior line
noise rejection and very high regulator gain which leads to ex-
cellent line and load regulation. An impressive ±2.2% accuracy
is guaranteed over line, load and temperature.
Printed Circuit Board Layout Consideration
Surface mount components rely on the conductive traces or
pads to transfer heat away from the device. Appropriate PC
board layout techniques should be used to remove heat from the
immediate vicinity of the package.
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