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ADP171AUJZ-R7 PDF预览

ADP171AUJZ-R7

更新时间： 2024-01-03 18:47:26
品牌 Logo 应用领域
亚德诺 - ADI 线性稳压器IC调节器电源电路光电二极管输出元件PC
页数 文件大小 规格书
20页 538K
描述
300 mA, Low Quiescent Current, CMOS Linear Regulators

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ADP171AUJZ-R7 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：TSOT
包装说明：VSSOP,针数：5
Reach Compliance Code：unknown风险等级：5.41
最大回动电压 1：0.135 VJESD-30 代码：R-PDSO-G5
JESD-609代码：e3长度：2.9 mm
湿度敏感等级：NOT APPLICABLE功能数量：1
端子数量：5工作温度TJ-Max：125 °C
工作温度TJ-Min：-40 °C最大输出电流 1：0.3 A
最大输出电压 1：3 V最小输出电压 1：0.8 V
封装主体材料：PLASTIC/EPOXY封装代码：VSSOP
封装形状：RECTANGULAR封装形式：SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
峰值回流温度（摄氏度）：260认证状态：COMMERCIAL
调节器类型：ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR座面最大高度：1 mm
表面贴装：YES技术：CMOS
端子面层：MATTE TIN端子形式：GULL WING
端子节距：0.95 mm端子位置：DUAL
处于峰值回流温度下的最长时间：40宽度：1.6 mm
Base Number Matches：1

ADP171AUJZ-R7 数据手册

 浏览型号ADP171AUJZ-R7的Datasheet PDF文件第2页浏览型号ADP171AUJZ-R7的Datasheet PDF文件第3页浏览型号ADP171AUJZ-R7的Datasheet PDF文件第4页浏览型号ADP171AUJZ-R7的Datasheet PDF文件第6页浏览型号ADP171AUJZ-R7的Datasheet PDF文件第7页浏览型号ADP171AUJZ-R7的Datasheet PDF文件第8页 
ADP170/ADP171  
ABSOLUTE MAXIMUM RATINGS  
maximum power dissipation exists, close attention to thermal  
board design is required. The value of θJA may vary, depending  
on PCB material, layout, and environmental conditions. The  
specified values of θJA are based on a 4-layer, 4 in. × 3 in. PCB.  
Refer to JESD 51-7 for detailed information regarding board  
construction.  
Table 3.  
Parameter  
Rating  
VIN to GND  
VOUT to GND  
−0.3 V to +3.6 V  
−0.3 V to VIN  
EN to GND  
−0.3 V to +3.6 V  
−65°C to +150°C  
−40°C to +125°C  
−40°C to +85°C  
JEDEC J-STD-020  
Storage Temperature Range  
Operating Junction Temperature Range  
Operating Ambient Temperature Range  
Soldering Conditions  
ΨJB is the junction-to-board thermal characterization parameter  
with units of °C/W. The ΨJB of the package is based on modeling  
and calculation using a 4-layer board. The Guidelines for Reporting  
and Using Electronic Package Thermal Information: JESD51-12  
states that thermal characterization parameters are not the same  
as thermal resistances. ΨJB measures the component power flowing  
through multiple thermal paths rather than a single path as in  
thermal resistance, θJB. Therefore, ΨJB thermal paths include  
convection from the top of the package as well as radiation from  
the package—factors that make ΨJB more useful in real-world  
applications. Maximum junction temperature (TJ) is calculated  
from the board temperature (TB) and power dissipation (PD)  
using the formula  
Stresses above those listed under absolute maximum ratings  
may cause permanent damage to the device. This is a stress  
rating only and functional operation of the device at these or  
any other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
THERMAL DATA  
Absolute maximum ratings apply only individually, not in  
combination. The ADP170/ADP171 can be damaged when the  
junction temperature limits are exceeded. Monitoring ambient  
temperature does not guarantee that TJ is within the specified  
temperature limits. In applications with high power dissipation  
and poor thermal resistance, the maximum ambient temperature  
may have to be derated.  
TJ = TB + (PD × ΨJB)  
Refer to JESD51-8 and JESD51-12 for more detailed information  
about ΨJB.  
THERMAL RESISTANCE  
θJA and ΨJB are specified for the worst-case conditions, that is, a  
device soldered in a circuit board for surface-mount packages.  
In applications with moderate power dissipation and low PCB  
thermal resistance, the maximum ambient temperature can  
exceed the maximum limit as long as the junction temperature  
is within specification limits. The junction temperature (TJ) of  
the device is dependent on the ambient temperature (TA), the  
power dissipation of the device (PD), and the junction-to-  
ambient thermal resistance of the package (θJA).  
Table 4. Thermal Resistance  
Package Type  
θJA  
ΨJB  
Unit  
5-Lead TSOT  
170  
43  
°C/W  
ESD CAUTION  
Maximum junction temperature (TJ) is calculated from the  
ambient temperature (TA) and power dissipation (PD) using the  
following formula:  
TJ = TA + (PD × θJA)  
Junction-to-ambient thermal resistance (θJA) of the package is  
based on modeling and calculation using a 4-layer board. The  
junction-to-ambient thermal resistance is highly dependent on  
the application and board layout. In applications where high  
Rev. B | Page 5 of 20  
 
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