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ADP125ARHZ PDF预览

ADP125ARHZ

更新时间： 2024-02-17 07:09:21
品牌 Logo 应用领域
亚德诺 - ADI 稳压器
页数 文件大小 规格书
20页 632K
描述
5.5 V Input, 500 mA, Low Quiescent Current, CMOS Linear Regulators

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ADP125ARHZ 技术参数

是否无铅： 含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：TSSOP
包装说明：HTSSOP, TSSOP8,.19针数：8
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01风险等级：1.47
可调性：ADJUSTABLE最大回动电压 1：0.23 V
标称回动电压 1：0.13 V最大差分输入-输出电压：5.5 V
最小差分输入-输出电压：2.3 VJESD-30 代码：S-PDSO-G8
JESD-609代码：e3长度：3 mm
湿度敏感等级：3功能数量：1
输出次数：1端子数量：8
工作温度TJ-Max：125 °C工作温度TJ-Min：-40 °C
最高工作温度：125 °C最低工作温度：-40 °C
最大输出电流 1：0.5 A最大输出电压 1：5 V
最小输出电压 1：0.8 V封装主体材料：PLASTIC/EPOXY
封装代码：HTSSOP封装等效代码：TSSOP8,.19
封装形状：SQUARE封装形式：SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
包装方法：TUBE峰值回流温度（摄氏度）：260
认证状态：Not Qualified调节器类型：ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR
座面最大高度：1.1 mm子类别：Other Regulators
表面贴装：YES技术：CMOS
端子面层：Matte Tin (Sn)端子形式：GULL WING
端子节距：0.65 mm端子位置：DUAL
处于峰值回流温度下的最长时间：30宽度：3 mm
Base Number Matches：1

ADP125ARHZ 数据手册

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Data Sheet  
ADP124/ADP125  
ABSOLUTE MAXIMUM RATINGS  
application and board layout. In applications in which high maxi-  
mum power dissipation exists, close attention to thermal board  
design is required. The value of θJA may vary, depending on PCB  
material, layout, and environmental conditions. The specified  
values of θJA are based on a 4-layer, 4 inch × 3 inch circuit board.  
Refer to JESD 51-7 for detailed information on the board  
construction.  
Table 3.  
Parameter  
Rating  
VIN to GND  
ADJ to GND  
EN to GND  
VOUT to GND  
−0.3 V to +6.5 V  
−0.3 V to +6.5 V  
−0.3 V to +6.5 V  
−0.3 V to VIN  
Storage Temperature Range  
Operating Ambient Temperature Range  
Operating Junction Temperature Range  
Soldering Conditions  
−65°C to +150°C  
−40°C to +85°C  
−40°C to +125°C  
JEDEC J-STD-020  
ΨJB is the junction-to-board thermal characterization parameter  
and is measured in °C /W. The ΨJB of the package is based on  
modeling and calculation using a 4-layer board. The Guidelines for  
Reporting and Using Package Thermal Information: JESD51-12  
states that thermal characterization parameters are not the same  
as thermal resistances. ΨJB measures the component power flowing  
through multiple thermal paths rather than a single path as in  
thermal resistance, θJB. Therefore, ΨJB thermal paths include  
convection from the top of the package as well as radiation from  
the package—factors that make ΨJB more useful in real-world  
applications. Maximum junction temperature (TJ) is calculated  
from the board temperature (TB) and power dissipation (PD)  
using the formula  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
THERMAL DATA  
Absolute maximum ratings apply individually only, not in  
combination. The ADP124/ADP125 can be damaged when the  
junction temperature limits are exceeded. Monitoring ambient  
temperature does not guarantee that TJ will remain within the  
specified temperature limits. In applications with high power  
dissipation and poor thermal resistance, the maximum ambient  
temperature may have to be limited.  
TJ = TB + (PD × ΨJB)  
Refer to JESD51-8 and JESD51-12 for more detailed information  
about ΨJB.  
THERMAL RESISTANCE  
θJA and ΨJB are specified for the worst-case conditions, that is, a  
device soldered in a circuit board for surface-mount packages.  
In applications with moderate power dissipation and low PCB  
thermal resistance, the maximum ambient temperature can  
exceed the maximum limit as long as the junction temperature  
is within specification limits. The junction temperature (TJ) of  
the device is dependent on the ambient temperature (TA), the  
power dissipation of the device (PD), and the junction-to-ambient  
thermal resistance of the package (θJA).  
Table 4. Thermal Resistance  
Package Type  
8-Lead MSOP  
8-Lead LFCSP  
θJA  
ΨJB  
Unit  
°C/W  
°C/W  
102.8  
68.9  
31.8  
44.1  
ESD CAUTION  
Maximum junction temperature (TJ) is calculated from the  
ambient temperature (TA) and power dissipation (PD) using the  
formula  
TJ = TA + (PD × θJA)  
The junction-to-ambient thermal resistance (θJA) of the package  
is based on modeling and calculation using a 4-layer board. The  
junction-to-ambient thermal resistance is highly dependent on the  
Rev. C | Page 5 of 20  
 
 
 
 
 
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