ADN2847
2620ꢀm
2280ꢀm
GND2
GND2
IMMON
GND3
V
3
FAIL
CLKSEL GND
CC
IDTONE IBMON
ALS DEGRADE GND
DIE ROTATED 90ꢂ IN PACKAGE
GND2
GND
V
2
CC
CLKN
CLKP
IMODN
IMODN
GND2
GND1
1
IMODP
IMODP
DATAP
DATAN
GND1
GND2
GND2
2620ꢀm
V
1
CC
GND
I
BIAS
I
PAVCAP
ERCAP
BIAS
CCBIAS
GND
ASET
PSET
GND
IMPD
IMPDMON2
GND4
IMPD2
LBWSET
ERSET
IMPDMON
V
4
CC
Figure 3. Bonding Diagram
Figure 2. Metallization Photograph
DIE PAD COORDINATES*
Pad Number
Pad Name
x[ꢀm]
Y[ꢀm]
Pad Number
Pad Name
CC3
GND3
IMMON
IBMON
GND2
IDTONE
GND2
x[ꢀm]
Y[ꢀm]
1
2
3
4
5
6
7
8
TP1 (GND)
LBWSET
ASET
ERSET
PSET
TP2 (GND)
IMPD
IMPDMON
IMPDMON2
IMPD2
–996
–996
–996
–996
–996
–996
–996
–996
–996
–996
–996
–995
–925
–777
–606
–389
–200
–70
83
263
442
596
762
996
996
996
1026
853
679
506
332
159
–15
506
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
V
996
996
996
996
996
995
995
867
713
500
396
242
88
–16
–239
–443
–633
–772
–912
–19
251
441
614
804
993
1133
1191
1191
1191
1191
1191
1191
1191
1191
1191
1191
1191
1191
GND2
9
–361
–534
–724
–964
–1191
–1191
–1191
–1191
–1191
–1191
–1191
–1191
–1191
–1191
–1191
–1109
–935
–762
–589
–415
–242
VCC
2
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
IMODN
IMODN
GND2
IMODP
IMODP
GND2
GND2
IBIAS
GND4
VCC
4
ERCAP
PAVCAP
TP3 (GND)
VCC
1
GND1
DATAN
DATAP
GND1
CLKP
CLKN
TP4 (GND)
TP5 (GND)
TP6 (GND)
CLKSEL
DEGRADE
FAIL
IBIAS
CCBIAS
*With the origin in the center of the die (see Figure 2).
996
996
996
ALS
–4–
REV. 0