ADM1490E/ADM1491E
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
TA = 25°C, unless otherwise noted.
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount pacꢀages.
Table 3.
Parameter
Rating
Table 4. Thermal Resistance
VCC to GND
−0.3 V to +7 V
Digital I/O Voltage (DE, RE)
Driver Input Voltage (DI)
Receiver Output Voltage (RO)
Driver Output/Receiver Input Voltage
(A, B, Y, Z)
−0.3 V to VCC + 0.3 V
−0.3 V to VCC + 0.3 V
−0.3 V to VCC + 0.3 V
−9 V to +14 V
Pacꢀage Type
θJA
Unit
°C/W
°C/W
°C/W
°C/W
8-Lead SOIC
121
86
133
133
14-Lead SOIC
8-Lead MSOP
10-Lead MSOP
Operating Temperature Range
Storage Temperature Range
ESD (HBM) on A, B, Y, and Z
−40°C to +85°C
−55°C to +150°C
8 kV
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rev. B | Page 5 of 16