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ADM1032ARM PDF预览

ADM1032ARM

更新时间: 2024-02-29 15:08:13
品牌 Logo 应用领域
安森美 - ONSEMI 光电二极管
页数 文件大小 规格书
18页 205K
描述
IC SPECIALTY ANALOG CIRCUIT, PDSO8, MO-187AA, MSOP-8, Analog IC:Other

ADM1032ARM 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Active零件包装代码:TSSOP
包装说明:TSSOP,针数:8
Reach Compliance Code:unknown风险等级:5.05
Is Samacsys:N其他特性:PROGRAMMABLE OVER/UNDER TEMPERATURE LIMIT
模拟集成电路 - 其他类型:ANALOG CIRCUITJESD-30 代码:S-PDSO-G8
JESD-609代码:e0长度:3 mm
湿度敏感等级:1功能数量:1
端子数量:8最高工作温度:120 °C
最低工作温度:封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP封装形状:SQUARE
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH峰值回流温度(摄氏度):240
座面最大高度:1.1 mm最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:YES温度等级:OTHER
端子面层:TIN LEAD端子形式:GULL WING
端子节距:0.65 mm端子位置:DUAL
处于峰值回流温度下的最长时间:30宽度:3 mm
Base Number Matches:1

ADM1032ARM 数据手册

 浏览型号ADM1032ARM的Datasheet PDF文件第1页浏览型号ADM1032ARM的Datasheet PDF文件第3页浏览型号ADM1032ARM的Datasheet PDF文件第4页浏览型号ADM1032ARM的Datasheet PDF文件第5页浏览型号ADM1032ARM的Datasheet PDF文件第6页浏览型号ADM1032ARM的Datasheet PDF文件第7页 
ADM1032  
ADDRESS POINTER  
REGISTER  
CONVERSION RATE  
REGISTER  
ON-CHIP  
TEMPERATURE  
SENSOR  
LOCAL TEMPERATURE  
LOW LIMIT REGISTER  
LOCAL TEMPERATURE  
VALUE REGISTER  
LOCAL TEMPERATURE  
HIGH LIMIT REGISTER  
2
3
D+  
A/D  
CONVERTER  
ANALOG  
MUX  
LIMIT  
COMPARATOR  
REMOTE TEMPERATURE  
LOW LIMIT REGISTER  
D  
RUN/STANDBY  
REMOTE TEMPERATURE  
BUSY  
REMOTE TEMPERATURE  
HIGH LIMIT REGISTER  
VALUE REGISTER  
LOCAL THERM LIMIT  
REGISTER  
REMOTE OFFSET  
REGISTER  
EXTERNAL THERM LIMIT  
REGISTER  
CONFIGURATION  
REGISTER  
EXTERNAL DIODE OPEN-CIRCUIT  
INTERRUPT  
MASKING  
6
4
ALERT  
THERM  
STATUS REGISTER  
ADM1032  
SMBUS INTERFACE  
1
5
7
8
V
GND  
SDATA  
SCLK  
DD  
Figure 1. Functional Block Diagram  
Table 1. ABSOLUTE MAXIMUM RATINGS  
Parameter  
Rating  
Unit  
V
Positive Supply Voltage (V ) to GND  
0.3, +5.5  
DD  
D+  
0.3 to V + 0.3  
V
DD  
Dto GND  
0.3 to +0.6  
0.3 to +5.5  
V
SCLK, SDATA, ALERT  
THERM  
V
0.3 to V + 0.3  
V
DD  
Input Current, SDATA, THERM  
Input Current, D−  
1, +50  
1
mA  
mA  
V
ESD Rating, All Pins (Human Body Model)  
> 1000  
150  
Maximum Junction Temperature (T  
Storage Temperature Range  
IR Reflow Peak Temperature  
)
°C  
°C  
°C  
°C  
°C  
J Max  
65 to +150  
220  
IR Reflow Peak Temperature for Pb-Free  
Lead Temperature (Soldering 10 sec)  
260  
300  
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the  
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect  
device reliability.  
NOTE: This device is ESD sensitive. Use standard ESD precautions when handling.  
Table 2. THERMAL CHARACTERISTICS  
Package Type  
q
Unit  
°C  
JA  
8-lead SOIC NB Package  
8-lead MSOP Package  
121  
142  
°C  
http://onsemi.com  
2

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